Materials Literature
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Extended X-ray absorption fine structure (EXAFS) and X-ray absorption near-edge structure (XANES) studies on [octa(2-ethylhexyloxy)phthalocyaninato]platinum [PtL] as a film at room temperature suggest that the structure consists of non-planar, concave discotic molecules packed perpendicular to the stacking axis.
A study of the interface between the crystal phase and the fluid phase has been carried out using self-consistent-field theory calculations. The results are expressed in terms of two interfacial factors: the surface characteristic scaling factor ${\mathit{C}}_{\mathit{l}}^{\mathrm{*}}$ and the characteristic thickness…
We present dynamical theory of soliton excitations in nonlinear coupled incommensurate chains which consists of two deformable chains of different atomic species, each with its own chemical potential, on the same substrate. In the continuum approximation, the motion equations are a set of coupled Sine-Gordon equations…
The jet from a shaped charge is formed by the collapse of its typically conical liner under the high pressures resulting from a detonation front. Nominally the charge is axisymmetric and the jet travels along the axis of symmetry of the charge. However, when asymmetries are present in the shaped charge the velocities…
Deux aspects de la méthode de calcul élasto-plastique des soutènements sont abordés.
Effects of acteoside (ACT) on crescentic-type anti-GBM nephritis in rats were investigated. When rats were treated with ACT from the 1st day after i.v. injection of anti-GBM serum, ACT inhibited the elevation of protein excretion into urine. In the ACT-treated rats, cholesterol and creatinine contents and antibody pro…
The effects of single addition (C, B<0.02%, Al<0.1%, others<0.5%) of various minor alloying elements such as C, Si, Mn, Cr, Mo, Cu, Nb, Ti, V, Al, W and B in 36%Ni base alloy on thermal expansion and Curie temperature (Tc) were investigated.The results obtained are as follows :(1) Thermal expansion coefficient between…
The effect of storage temperature on the physicochemical properties of soft gelatin capsule shells was studied to interpret a change in the internal structure of those capsule shells whose disintegration time was remarkably prolonged by storage at 40°C or more. The capsules were stored at 25, 40 or 60°C for a maximum…
Polymeric materials are an alternative to porcelain and glass regarding outdoor HV insulators. Silicone rubber appears to be one of the main candidates to replace porcelain and glass. Although much work has already been done regarding the behavior of complete polymeric insulators in the laboratory and in the field, re…
Ways of finding kinetic parameters useful for pharmaceutical formulators from thermal analytical methods (TGA, DSC) under both isothermal and non-isothermal conditions are suggested. We considered as an example those followed to determine the first-order kinetics of dehydration of cross-linked polyvinylpyrrolidone (PV…
Abstract Current‐voltage characteristics measured on TlGaTe 2 single crystals reveal switching effects at temperatures below 263 K. The current‐voltage characteristics are symmetric with respect to the polarity of the applied field. The threshold parameters for switching are found to depend on temperature, illuminatio…
A theoretical analysis of the resistance to bending of set plain-woven fabrics is presented. It is shown that no forces will be generated at the crossover points between the warp and weft threads when a fabric is bent by an external couple. The analysis yields convenient formulae for calculating the bending parameters…
ビフェニルの液相イソプロピル化反応におけるH-モルデナイト (HM), HYおよびHL等の12員環ゼオライトの触媒挙動を検討した。プロピレンをアルキル化剤とするイソプロピル化において, HM触媒のみが高い形状選択性を示し, イソプロピルビフェニル (IPBP) に関して4-IPBPが70%以上, ジイソプロピルビフェニル (DIPB) に関しては4,4'-DIPBが80%以上に達した。4,4'-DIPBの生成は逐次反応であり, モノアルキル化では4-IPBPが形状選択的に生成し, ジアルキル化ではIPBP異性体のうち, 4-IPBPが優先的に反応し高い選択率で4,4'-DIPBが生成する。この形状選択性は, 遷移状態における立体規…
Conventional NICALON fiber has a refractoriness of only about 1200°C because of its high oxygen content. Recently a new fiber HI-NICALON with improved refractoriness has been developed. The slurry process developed by the authors was adopted for the fabrication of HI-NICALON fiber-reinforced Si3N4 composites. Carbon-c…
The effect of partial discharges in benzyltoluene upon impregnated polypropylene films has been studied in a sphere/plane electrode geometry. It is shown that discharges even with a small apparent charge (/spl sim/1 pC) cause a significant decrease of the breakdown strength of the film. The addition of an epoxy compou…
A number of the test programs currently in progress at the Halden Project are aimed at evaluating Zircaloy cladding performance in terms of corrosion behavior, particularly at high burnup. A pressurized water reactor (PWR) facility has been used to determine the effects of high (4 to 4.5 ppm) lithium on the corrosion…
The thermal behaviour of five hydroxyphosphates, lipscombite [Fe3(PO4)2(OH)2], barbosalite [Fe3(PO4)2(OH)2], giniite [Fe5(PO4)4(OH)2· 2H2O], rockbridgeite Fe5(PO4)3(OH)5] and Fe4(PO4)3(OH)3, has been studied. Thermogravimetric analysis revealed the hydroxyphosphates to have distinct behaviours: some underwent dehydrox…
Non-reactive pure metals do not wet ionocovalent oxides like alumina and silica. It is believed generally that a strong improvement of wetting can be produced by alloying elements presenting a high reactivity with the oxide substrate. In this study, existing data on contact angles are reviewed and analysed in order to…
The effects of additions of 0.1–2.0% of Co, Ni and Ti on the cellular precipitation in a Cu-2 mass%Be alloy were investigated by the quantitative metallographic method.The addition of Co, Ni and Ti hastened the start of the precipitation of γ′ phase in the matrix and increased slightly the maximum hardness. These elem…
The etching process for a Cu interconnect with self-aligned deposition of a thick sidewall film has been developed. This sidewall film acts as a barrier layer to prevent Cu from corrosion and oxidation during the subsequent process, such as formation of a passivation film. Using this etching process, the Cu interconne…