Materials Literature
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La technologie des cellules souches et les sciences de biomatériaux ont obtenu des grands progrès au cours des dernières décennies et sont devenues plus populaires dans le monde. Les chercheurs cherchent à étudier et à évaluer les différentes sources de cellules et de biomatériaux qui, en combinaison, peuvent fournir…
The new American College of Cardiology/American Heart Association guideline reclassified office blood pressure and proposed thresholds for ambulatory blood pressure (ABP). We derived outcome-driven ABP thresholds corresponding with the new office blood pressure categories. We performed 24-hour ABP monitoring in 11 152…
The dynamic processes of knowledge production in archaeology and elsewhere in the humanities and social sciences are increasingly viewed as the collaborative effort of groups, clusters and communities of researchers rather than the isolated work of so-called ‘instrumental’ actors. Shifting focus from the individual sc…
This announces the first successful attempt at using model-checking techniques to verify the correctness of self-stabilizing distributed algorithms for robots evolving in a continuous environment.The study focuses on the problem of rendezvous of two robots with lights and presents a generic verification model for the…
La réalisation de supraconducteurs topologiques constitue un des principaux enjeux actuels de la physique de la matière condensée. Il a en effet été prédit que ces systèmes devaient abriter des fermions de Majorana. Ces fermions de Majorana disposent à la fois d’une statistique non-abélienne et, du fait de leur origin…
The microstructure determines the photovoltaic performance of a thin film organic semiconductor film. The relationship between microstructure and performance is usually highly non-linear and expensive to evaluate, thus making microstructure optimization challenging. Here, we show a data-driven approach for mapping the…
The American Concrete Institute (ACI) is a leading authority and resource worldwide for the development and distribution of consensus-based standards, technical resources, educational programs, certification programs, and proven expertise for individuals and organizations involved in concrete design, construction, and…
The International Concrete Abstracts Portal is an ACI led collaboration with leading technical organizations from within the international concrete industry and offers the most comprehensive collection of published concrete abstracts.
ABSTRACT Solder reflow technology is volume manufacturing ready to an interconnect pitch of about 60um for two main reasons. Solder has the ability to compensate for height differences among the interconnects on a die or package through the melting and re-solidification process. The second reason is that pick-and-plac…
ABSTRACT Panel plating requirements are much more demanding as more applications migrate from silicon to panel assembly such as Panel Level Fan Out (PLFO) to leverage the large sizes of the panels. More recently, Heterogeneous Integration (HI) like Intel’s Embedded Bridge (EMIB) or various other embedded die concepts…
ABSTRACT Over the last few years fan out wafer level packages (FOWLP) have gained significant traction and industry acceptance in product applications that have small form factor requirements. There are different FOWLP flavors that are in high volume production. High density FOWLP that are used for mobile phone applic…
ABSTRACT For years high performance computing (HPC) products have been integrating more and more functions in the IC. Large die size with high density transistor is still the trend for IC product design, especially networking and CPU product. As Moore’s law nears its physical limits, split die and heterogeneous integr…
ABSTRACT The electrical reliability of multilayer High Density Interconnection Printed Circuit boards (HDI PCBs) is mainly affected by the thermo-mechanical stability of stacked micro via interconnections. In this regard, a critical failure mode is the stress related crack between the electrolytically filled via and t…
ABSTRACT In this paper we show that Wave Front Phase Imaging (WFPI) has good enough lateral resolution and is sensitive enough to measure roughness on a silicon wafer by simply acquiring a simple image of the entire wafer. WFPI is achieved by measuring the reflected light intensity from monochromatic uncoherent light…
ABSTRACT Solder-based fine pitch microbumps along with through silicon vias (TSV) enable high density interconnects for die-to-die and die-to-wafer stacking for different applications. With reduction in bump dimensions, several challenges arise that need to be addressed. For example, selection of under bump metallizat…
ABSTRACT 3D architectures are increasingly making their way into commercial products such as image sensors and 3D memory. While hybrid bonding exists today in wafer-to-wafer (W2W) format in high volume manufacturing, the proliferation of this technology continues to accelerate. A wide range of new products may be cons…
ABSTRACT As demand for ever more powerful personal handheld devices and advanced computing systems continues to grow, front-end manufacturers have pushed Moore’s Law to the limit and integrated more functionality into their chips while at the same time reducing their physical footprint. Modern chips now contain more I…
ABSTRACT X-ray fluorescence (XRF) analysis is a widely used technique to measure plating thickness. Its main advantage resides in allowing simultaneous, non-destructive analysis of multilayered plated parts. The miniaturization and increasing complexity of electronic devices proliferated by advancements in smartphone…
ABSTRACT Over the past few years, polymers have appeared almost everywhere in microelectronics. Their conditions of processing and the high variability of their mechanical properties require the use of materials such as glue, passive layer, underfill etc. The mechanical behavior of polymers is characterized by viscoel…
ABSTRACT The taking of x-ray images goes back over 100 years, since then there have been numerous advances in x-ray tube and detector technology and these have been increasingly applied into helping with the manufacturing of electronic components and assemblies, as well as in their failure analysis. Most recently, thi…