M. V. Gavrikov、N. D. Zhukov、D. S. Mosiyash 等 4 位作者2018-12-01Technical Physics Letters
The electron emission properties of submicron Si, GaAs, InSb, and InAs semiconductor particles and their multigrain structures have been investigated. The effect of the properties of nanoparticles on the field and secondary emissions has been established. A scanning electron microscopy-based method for measuring the s…
Electron and X-Ray Spectroscopy TechniquesChemical and Physical Properties of MaterialsMaterial Properties and Failure Mechanisms
А. Д. Зорина、V. L. Polozova、S. A. Marchenko 等 5 位作者2018-12-01Russian Journal of Organic Chemistry
Cyanoethylation of natural glycyrrhetic acid methyl ester gave the corresponding 3β- O -(2-cyanoethyl) derivative which was treated with sodium azide to obtain a novel tetrazolyl derivative of biologically active triterpenoid, methyl 3β-[2-(1 H -tetrazol-5-yl)ethoxy]-11-oxoolean-12-en-30-oate.
Natural product bioactivities and synthesisPharmacological Effects of Natural CompoundsPhytochemistry and Bioactive Compounds
Tatsuhiko Miura、Shota Takita、Makoto Usuki 等 7 位作者2018-12-01OpenAlex
The method of improving thickness uniformity of sputter-deposited film by using magnet rotation speed control technique as an advanced process control (APC) is discussed. It is demonstrated that magnet rotation speed control technique can improve both film thickness uniformity and its variation.
Metal and Thin Film MechanicsCopper Interconnects and ReliabilityAdhesion, Friction, and Surface Interactions
V. F. Kolesov2018-12-01Physics of Atomic Nuclei
The history of formation and practical realization of the concept of the coupled reactor facilities that was embodied in the domain of aperiodic pulsed reactors is traced back. It is demonstrated that the application of the concept of coupled reactor facilities extends significantly the potentialities of the experimen…
Nuclear reactor physics and engineeringGraphite, nuclear technology, radiation studiesNuclear and radioactivity studies
Bisheng Wang、Liao Jinzhi Lois、Xiaomin Li2018-12-01OpenAlex
Aluminum (Al) has been used as an interconnection material for the last 40 years. As the ultra-largescale integrated devices become more and more smaller, there are demands for the semiconductor gate performance to be improved through the use of a higher drive current and a lower junction capacitance. One attempt is t…
Electronic Packaging and Soldering Technologies3D IC and TSV technologiesCopper Interconnects and Reliability
Changmin Song、Sungdong Kim、Sarah Eunkyung Kim2018-12-01OpenAlex
Integrated circuit (IC) technologies have been significantly changed due to the strong demands of high performance, multifunction, low power, small size, and low cost. Furthermore, IC technology paradigms have been shifted to one-chip integration, 3D integration, and multi-function integration. However, since the scal…
Copper Interconnects and ReliabilitySynthesis and properties of polymersSilicone and Siloxane Chemistry
Елена Александровна Тихомирова、Е. Ф. Сидохин2018-12-01Russian Metallurgy (Metally)
Abstract The methods of thermal cyclic tests used for determining the thermal fatigue resistance of materials are analyzed using thermal cyclic maps (TC maps). These methods are based on the construction of the dependence of life time N on plastic strain in a cycle εp. An analysis showed that the dependence of N on εp…
Fire effects on concrete materialsMaterial Properties and ApplicationsMaterial Properties and Failure Mechanisms
N. A. Bystrova、B. G. Stepanov2018-12-01Russian Journal of Nondestructive Testing
The paper considers how elastic displacements and mechanical stresses are distributed along a laminated transducer consisting of two piezoelectric plates with different amplitude-phase excitation that are separated by an intermediate layer and have their outer surfaces loaded on arbitrary input impedances. We analyze…
Aeroelasticity and Vibration ControlMaterial Properties and ApplicationsStructural mechanics and materials
Vivek Chidambaram、Wai Leong Ching2018-12-01OpenAlex
Niche applications in automobile and aerospace industries such as the management of integrity and operation based on the inputs from the network of sensors (e.g. pressure, accelerometer, vibration etc.) that are strategically located close to the high temperature area of the engine, requires reliable packaging solutio…
Electronic Packaging and Soldering TechnologiesAdvanced Welding Techniques AnalysisMetallurgical and Alloy Processes
Mithun Das、Abdulla Al-Momin、A. K. M. Akther Hossain2018-12-01OpenAlex
The ferromagnetic Li0.l0CU0.lONio.30Zno.4oFe2.1O4synthesized by the typical ceramic technique which is sintered at the various temperatures. The formation of single phase cubic spinel structure at varied sintering temperatures (Ts) is confirmed by the x-ray diffraction (XRD) analysis. XRD pattern confirms that the Tsd…
Magnetic properties of thin filmsMagnetic Properties and Synthesis of FerritesIron oxide chemistry and applications
L. S. Kokhan、Yu. A. Morozov、E. V. Krutina2018-12-01Russian Metallurgy (Metally)
Abstract The kinematics of the deformation zone during lengthwise rolling is considered, and the slip, retardation, and gathering region lengths are studied. The condition of absent retardation region and passage to a four-region deformation zone is determined.
Microstructure and Mechanical Properties of SteelsMetallurgy and Material FormingMetal Alloys Wear and Properties
Rédouane Zitoune、Francis Collombet、Kamel Moussaoui 等 4 位作者2018-12-01Plastiques et composites
L’association par empilement de matériaux comme l’aluminium et le composite matrice époxy/fibres de carbone pose de nombreux problèmes en matière de perçage dus à la différence de leur usinabilité. De fait, on ne peut simplement juxtaposer les études réalisées sur chaque matériau constitutif pour ré
Advanced ceramic materials synthesisCellular and Composite StructuresFiber-reinforced polymer composites
Ling Xie、Ser Choong Chong2018-12-01OpenAlex
Fine Pitch interconnects for 2.5D Packaging is developed with the aim of meeting the need for higher functionality and higher power. Cu-Cu interconnect is preferred over the solder interconnect as solder may merged as the pitch is of fine dimension. Cu-Cu interconnects have many challenges such as Cu oxide formation,…
Electronic Packaging and Soldering Technologies3D IC and TSV technologiesCopper Interconnects and Reliability
M. V. Erëmin、D. S. Kochergin、Mikhail Malakhov2018-12-01Journal of Experimental and Theoretical Physics Letters
The solutions of the Bardeen–Cooper–Schrieffer equation are found within the model of the lower Hubbard subband taking into account three-site correlations and the superexchange, Coulomb, phonon, and spinfluctuation mechanisms of quasiparticle pairing. The Pr 0.89 LaCe 0.11 CuO 4 compound is considered as an example.…
Physics of Superconductivity and MagnetismMagnetic and transport properties of perovskites and related materialsAdvanced Condensed Matter Physics
Toshihide Agemura、Takashi Sekiguchi2018-12-01OpenAlex
The “fountain detector (FD)”, which is a low-pass secondary electron detector in a scanning electron microscope (SEM), has been developed in order to visualize the surface potential variation or the dopant density for semiconductor materials. A 4H-SiC p-n junction, which has different dopant densities in the p-region,…
Semiconductor materials and devicesSilicon and Solar Cell TechnologiesElectron and X-Ray Spectroscopy Techniques
Mansura Sadek、Md. Kawsar Alam2018-12-01OpenAlex
We present an AlGaN/GaN high electron mobility transistor (HEMT) operating in enhancement-mode (E-mode) with metal-insulator-semiconductor (MIS) structure showing improved threshold voltage. The design includes an aluminium gallium nitride (Alo.3Gao.7N) barrier layer of 5-nm-thickness and a silicon nitride (SiN) passi…
GaN-based semiconductor devices and materialsGa2O3 and related materials
Junjie Li、Tielin Shi、Guanglan Liao 等 4 位作者2018-12-01OpenAlex
We proposed a low-temperature Cu-Cu bonding method by a new type of self-reducible Ag ion paste in this paper. The Ag ion paste is free of any particles or precipitates, which can be easily prepared and stored. Because of its high dispersion characteristic, the Ag ion paste can also be uniformly coated or written on s…
Electronic Packaging and Soldering Technologies3D IC and TSV technologiesCopper Interconnects and Reliability
A. G. Tur’yanskiĭ、S. S. Gizha、V. M. Senkov2018-12-01Technical Physics Letters
The efficiency of broadband filtering of a polychromatic X-ray spectrum by a polycapillary structure in the region of photon energies E > 10 keV was demonstrated. A polycapillary 40.5-mm-long rod made of borosilicate glass and containing 10 6 parallel hexagonal capillaries was used as a filter. Filtering was performed…
Glass properties and applicationsAdvanced X-ray Imaging TechniquesRadiation Shielding Materials Analysis
Steven Lee Hou Jang2018-12-01OpenAlex
Amorphous silicon (a-Si:H) thin films with deposition temperatures ranging from 100°C to 400°C from two different deposition chambers have been analyzed and characterized using various techniques including the Atomic Force Microscope (AFM). These amorphous silicon films were deposited in two separate Plasma Enhanced C…
Semiconductor materials and devicesThin-Film Transistor TechnologiesSilicon Nanostructures and Photoluminescence
В. П. Глазков、В. А. Соменков、E. S. Kovalenko 等 4 位作者2018-12-01Physics of Atomic Nuclei
The current state of neutron research at the IR-8 reactor is considered and it is shown that the research is focused on two main avenues: comprehensive radiation diagnostics for the sake of those knowledge domains which have not used it before and research of the structure of material under extreme conditions (high pr…
High-pressure geophysics and materialsNuclear Materials and PropertiesNuclear Physics and Applications