Materials Literature
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ABSTRACT We have been investigating polyurethane (PU) – based conformal coatings filled with the nanoparticles (nanosilica, nanoalumina) to mitigate tin whisker failure in Pb-free electronics. The added nanoparticles are functionalized with isocyanate, which enable them to be chemically bonded to the PU network. Agglo…
ABSTRACT We present here the findings of Alpha’s Alloy Development Program on the next generation of low temperature alloys that can be used in reflow soldering temperatures from 170 to 200oC. Approaches in alloy development, test methodologies and results are discussed. The alloy properties targeted for improvements…
ABSTRACT Selective soldering is a commonly used method of soldering through-hole (TH) components into a mixed-technology printed circuit board assembly (PCBA) that would otherwise either be hand soldered or soldered with a wave soldering machine using an aperture pallet to shield SMT components from the molten solder.…
ABSTRACT Through-hole soldering is alive and well in the electronics industry, despite its predicted demise at the hands of surface mount technology. Through-hole soldering is largely used for connectors, switches, and other components that require a high solder joint strength. High reliability circuit assemblies will…
ABSTRACT The power consumption by information technology equipment keeps rising as data center proliferation continues unabated. In order to contain the rising computing costs, data center administrators are resorting to cost cutting measures such as not tightly controlling the temperature and humidity levels and in m…
ABSTRACT DDR3 SDRAMs and other kinds of memories consist of compact electronic devices that feature a high memory density, minimized power consumption and high-speed operation. These enhanced components are typically housed in small form factor rectangle BGAs including leading-edge chips as well as advanced packaging…
ABSTRACT Although the price of silver has stabilised, it remains the most expensive element of the lead free Tin silver Copper (SAC) alloys. Lowering the level of silver has a number of effects beyond simply the cost of the alloy. It has been shown that decreasing the silver can improve the drop/mechanical shock resis…
ABSTRACT With electronics being integrated into higher temperature environments such as those associated with deep well drilling and distributed controls for “under the hood” automotive applications, higher melting temperature solders are needed. While limited data on bulk high temperature solders is available, data o…
ABSTRACT Nanotechnology has the potential to have a positive impact on electronics assembly. Nanotechnology works with nanoscale particles which has dimension typically from 1 to 100 nanometers. When the particle size of an element reaches nanoscale, its properties such as melting point, fluorescence, electrical condu…
ABSTRACT A difference between the lead-free solders based on tin, copper and silver and the tin-lead solders that they are replacing is that they do not take advantage of the solid solution strengthening. The two elements that are added to tin, separately or together, to make the most widely used lead-free solders, si…
ABSTRACT Several new applications requiring solder materials that would perform for extended periods under harsh operating conditions have recently emerged. Clearly there is a need for a ROHS compliant solder with thermal and mechanical reliability better than Sn-Ag3-Cu0.5/ Sn-Ag4-Cu0.5 but with a similar melting rang…
ABSTRACT Is there a benefit to using wave soldering fluxes that contain rosin versus ones that do not? Rosin-based fluxes are some of the original types of fluxes used in the early years of the electronics industry. They are based on material obtained from pine trees and other plants, primarily conifers. Rosin-based f…
ABSTRACT Especially for the SMT new trends like miniaturization 0201, 01005, 0201 (metrics) for passive components, as well as new devices for actives like LGA or QFN, it requires a lot of investigation for researching, developing, questioning about application, product/component mix, and finally about reliability. On…
ABSTRACT In this experiment, the thermal shock performance of various doped solder paste alloys on leaded and leadless lead free packages on laminate assemblies were observed in order to determine their reliability. This investigation is based on determining the potential solution to replace the SAC 305 packages which…
ABSTRACT The reliability of solder interconnects often depends on the surface finishes of the two opposing interfaces of the joint. For the case of a wafer level chip scale package (WLCSP), reliability may be further influenced by the geometry of the CSP metallization structure. This study explores several of these co…
ABSTRACT Conformal coatings are used to promote the survival of electronic assemblies in harsh environments as encountered by military / aerospace applications. Such coatings are intended to protect against corrosive environmental agents and more recently to constrain the growth of Sn whiskers and prevent their shorti…
ABSTRACT In the 2000s, red phosphorous flame retardants were at the root of widespread and costly failures in electronics products. The most prominent of these failures were in plastic encapsulated microcircuits. These failures were widely reported and painfully experienced. As a result, users of electronic components…
ABSTRACT Regarding Electro-less Ni/Pd/Au (ENEPIG) deposits, we focused on the type of Pd deposit, especially different P contents between 0 and 6% in the Pd deposit and we compared each characteristic. As a result, we found that Pd deposits with each P content had a best range of Pd thickness for solder joint reliabil…
ABSTRACT Phosphorus has long been a “secret ingredient” in tin-lead solder, particularly solder made with recycled metal, as it is a powerful deoxidant that removes dross and brings a sparkle to the surface of the molten solder. With the change to high-silver lead-free solders, which have a strong tendency to oxidize…
ABSTRACT A careful experimental investigation was undertaken to evaluate the soldering process and the reliability of solder joints of SnAgCu PBGA components formed using the Sn- Pb solder paste. Initially, a series of the reflow soldering profiles were developed to assure the complete mixing of the SAC ball and Sn-Pb…