Materials Literature
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Development of subsystems like PD emulators is an approach to operation optimization and real-time condition monitoring in future smart grid. This paper illustrates the method of PD locating based on the technique of VHF based emulator development. A partial discharge emulator consists of a spark plug and miniature el…
A possibility of electrical control of nonreciprocity inversion of microwave propagation when using a metastructure with a ferrite plate and varactor-loaded dipole is demonstrated. In contrast to conven-tional methods, the inversion occurs without ferrite remagnetization. It is reached by varying the constant bias vol…
Summary Sawdust/poly(lactic acid) (PLA) composites were prepared using a melt blending process. Sawdust content was 30 wt%. The effects of alkali treatment and poly(butylene adipate‐co‐terephthalate) (PBAT) content on mechanical, thermal, and morphological properties of the composites were investigated. With the addit…
Summary Summary A poly(l‐lactide‐co‐caprolactone), P(LL‐co‐CL), 75:25 mol % copolymer was synthesized via the bulk ring‐opening copolymerization of l‐lactide (LL) and ϵ‐caprolactone (CL) at 130 °C for 48 hrs. The P(LL‐co‐CL) copolymer obtained was characterized in terms of its molecular weight (GPC), copolymer composi…
Emerging solid state memory devices based on different materials and volatility has been widely acknowledged like NVRAMs (or Memristor). Evolution of new solid state ionic conductors and in particular (Memristor) brought impetus to the creation of new domain of larger storage capabilities for the future electronic sys…
Porous microspheres of glycidyl methacrylate cross-linked with trimethylolpropane trimethacrylate were prepared with toluene as porogen by suspension–emulsion polymerization. With increasing molar ratio of the functional monomer to cross-linker, the epoxy group content increases significantly, whereas the parameters o…
Dispensing is one of the key technologies in LED packaging, as the dispensed underfill can protect the interconnection from short-circled, release the residual stress and adjust color. However, in order to meet different requirements in packaging, various of underfill are used, typically from newton fluid to shear thi…
In order to extend the performances of integrated circuit (IC), new bonding approaches are being explored. Since copper has good electrical and thermal conductivity, and relatively low cost, it is widely used as the bonding material for advanced packaging. Unfortunately, the normal direct copper-to-copper bonding dema…
Through silicon via (TSV) is a critical element for three-dimensional (3D) integration of devices in vertically multilevel stack-die microelectronic packages. In this paper, the microstructure evolution of TSV-Cu under thermal cycling was studied and the topography of TSVs under thermal cycling tests was examined by w…
Graphene-base film was fabricated with chemical conversion process, including graphene oxide (GO) prepared by Hummer's method, graphene oxide reduced with L-ascorbic acid (LAA), graphene based film deposited by vacuum filtration process. Meanwhile, the functionalization of the graphene-based film was performed to decr…
With the increasing miniaturization of electronic devices and systems, the dimension of solder joints and pitches has been continuously scaling down, while the current density carried by solder joints increasing significantly, consequently a critical issue, electromigration (EM), has become a key reliability concern.…
In this study, 0.8 wt% Al2O3nanoparticles doping Sn3.0Ag0.5Cu (SAC) lead-free solder was prepared through the powder metallurgy route. The microstructures and the electromigration (EM) behavior of the composite solder joints were then studied by an environment scanning electron microscopy (ESEM). After 0.8 wt% Al2O3na…
Abstract Herein, we describe how a peptide amphiphile, consisting of a pro-apoptotic peptide and a hydrophobic tail connected by a reduction-responsive cleavable spacer, forms self-assembled nanostructures. In the presence of polycations, this amphiphile exhibits loosely entangled nanofiber morphology with a length of…
Aluminium oxide (Al 2 O 3 )functions doubly as a high-quality surface passivation material for crystalline silicon and as an aluminium (Al) p-type precursor for laser doping. Thus, p + doping based on laser ablation of Al 2 O 3 thin-films deposited on a silicon substrate is an attractively simplified process for concu…
Sialyltransferases are key enzymes involved in the biosynthesis of biologically and pathologically important sialic acid-containing molecules in nature. In this study, the activity of a putative sialyltransferase (Pm0160) harboring an inherent mutation D141Y in the conserved DDG motif, which has been identified in GT5…
A corroded tee pipe belonging to a 10-in new separator water line outlet installed in an offshore oil well drilling rig was investigated. The configuration of the large corroded pit had the shape of an imperfect horse's hoof with a completely corroded interior and a honeycomb-like cavity. There is a badly corroded pit…
Richard Wuhrer, Ken Moran; Dedicated X-Ray mapping system with single and multiple SDD detectors for quantitative X-Ray mapping and data processing, Micros
Oktay Elkoca, Kemal Davut; Metallographic Sample Preparation and Characterisation of Oxide Scales on Hot-Rolled Steel Strips, Microscopy and Microanalysis,
A Valery, E F Rauch, A Pofelski, L Clement, F Lorut; Dealing With Multiple Grains in TEM Lamellae Thickness for Microstructure Analysis Using Scanning Prec
Abstract The discovery of quasi-two-dimensional (Q2D) crystals has started a new era of materials science. Novel materials, atomically thin and mechanically, thermally and chemically stable, with a large variety of electronic properties are available and they can be assembled in ultrathin flexible devices. Understandi…