Materials Literature
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In this paper new characterization equipment for thermal interface materials is presented. Thermal management of electronic products relies on the effec-tive dissipation of heat. This can be achieved by the optimization of the system design with the help of simulation methods. The precision of these models relies also…
This work builds on the previous introduction [1] of a coupled experimental-computational system devised to fully characterize the thermal behavior of complex 3D submicron electronic devices. The new system replaces the laser-based surface temperature scanning approach with a CCD camera-based approach. As before, the…
Power consumption and heat dissipation become key elements in the field of high-end integrated circuits, especially those used in mobile and high-speed applications, due to their increase of transistor count and clock frequencies. Dynamic thermal management strategies have been proposed and implemented in order to mit…
In this paper we report on a novel simulation tool designed for the 3D coupled electro-thermal simulation of Smart Power Mosfets, that is a tool capable of taking into account not only the electrical (and thermal) behaviour of the power device but also the different driving strategies as they are imposed by a control…
Ground-state properties of the spin-1/2 and spin-1 Ising-Heisenberg model on doubly decorated planar lattices, are investigated in detail. On the basis of the mapping transformation method, we prove an existence of unusual quantum phases which occur due to the competition between Ising-type and XXZ anizotropic Heisenb…
Manufacturing electronic devices by printing techniques with low temperature sintering of nano-size material particles can revolutionize the electronics industry in coming years. The impact of this change to the industry can be significant enabling low-cost products and flexibility in manufacturing. implementation of…
A way to increase the Scanning Thermal Microscope (SThM) sensitivity in the harmonic 3w mode is to heat the probe with an AC current sufficiently high to generate a coupling between the AC and the DC signals. We detail in this paper how to properly take into account this coupling with a Wollaston-probe SThM. We also s…
This paper presents an improved methodology to generate Compact Thermal Models "CTMs" by using (VHDL-AMS) modeling language. This methodology makes it possible to have Boundary Conditions Independent "BCI" CTMs for multi chip components and systems while taking into account the nonlinear thermal conductivity of semico…
In the Square Kilometre Array (SKA) telescope [1], [2], the noise temperature of the first LNA must be reduced in order to reduce the necessary active area and the total system costs. Cooling the LNA locally would significantly decrease the noise figure but also the necessary power since not the whole system has to be…
In this paper the methodology and the results of a quasi real-time thermal characterization tool and method for the temperature mapping of circuits and boards based on sensing the infrared radiation will be introduced. With the proposed method the IR radiation-distribution of boards from the close proximity of the sen…
Some years ago we have proposed a thermal mount with electronically variable thermal resistance [1]. In this earlier work the feasibility of such a structure has been demonstrated. Now we intend to realize this mount in a maturated form, suitable to the everyday use in the practice of package thermal qualification and…
A network identification by deconvolution (NID) method is applied to the thermal transient response of packaged and unpackaged microcoolers. A thin film resistor on top of the device is used as the heat source and the temperature sensor. The package and the bonding thermal resistances can be easily identified by compa…
Besides their electrical properties the optical parameters of LEDs also depend on junction temperature. For this reason thermal characterization and thermal management play important role in case of power LEDs, necessitating both physical measurements and simulation tools. The focus of this paper is a combined electri…
Thermal measurement and modeling of multi-die packages became a hot topic recently in different fields like RAM chip packaging or LEDs / LED assemblies, resulting in vertical (stacked) and lateral arrangement. In our present study we show results for a mixed arrangement: an opto-coupler device has been investigated wi…
Prognostics is a process of assessing the extent of deviation or degradation of a product from its expected normal operating condition, and then, based on continuous monitoring, predicting the future reliability of the product. By being able to determine when a product will fail, procedures can be developed to provide…
This paper presents dynamic thermal analyses of a power amplifier. All the investigations are based on the transient junction temperature measurements performed during the circuit cooling process. The presented results include the cooling curves, the structure functions, the thermal time constant distribution and the…
This communication deals with a theoretical study of the hot spot onset (HSO) in cellular bipolar power transistors. This well-known phenomenon consists of a current crowding within few cells occurring for high power conditions, which significantly decreases the forward safe operating area (FSOA) of the device. The st…
Vitamin B6 is well known in its biochemically active form as pyridoxal 5'-phosphate, an essential cofactor of numerous metabolic enzymes. The vitamin is also implicated in numerous human body functions ranging from modulation of hormone function to its recent discovery as a potent antioxidant. Its de novo biosynthesis…
The size-dependent structure of CdSe nanoparticles, with diameters ranging from $2\phantom{\rule{0.3em}{0ex}}\text{to}\phantom{\rule{0.3em}{0ex}}4\phantom{\rule{0.3em}{0ex}}\mathrm{nm}$, has been studied using the atomic pair distribution function (PDF) method. The core structure of the measured CdSe nanoparticles can…
We report herein the preparation and UV-stimulated wettability conversion of superhydrophobic TiO 2 surfaces, as well as the preparation of superhydrophilic−superhydrophobic patterns by use of UV irradiation through a photomask. A CF 4 plasma was used to roughen smooth TiO 2 sol−gel films to produce a nanocolumnar mor…