Materials Literature
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An analytical model is presented to show the mechanisms of the electric field and temperature dependent effective drift mobility of holes in amorphous selenium (a-Se) considering the density of states distribution, thermally activated tunneling for the field enhancement release rate, and carrier heating. In addition,…
Abstract Evaluation techniques for semiconductor devices are keys for device development with low cost and short time to market. Especially, dopant and depletion layer distribution in devices is a critical electrical property that needs to be evaluated. Super-higher-order nonlinear dielectric microscopy (SHOSNDM) is o…
Current technology trend demands not only for high efficiency but also for portable devices, devices which can be carried and access anywhere and everywhere. This continues drives semiconductor's package towards miniaturization. One way is by placing active circuitry underneath the bond pads, this will reduce the die…
Effects of air flow on droplet removal from wafer were investigated as the fundamental study of CMP cleaning. Deformation and movement of droplet on wafer by air flow were visualized by a high speed camera, and characteristics of droplet behavior were evaluated. Effects of wafer film types (Two types of wafer, Type-A…
Ceria-based abrasives are indispensable for precise polishing of glass substrates. It is of great importance to understand degradation behavior of abrasive slurry for reducing the polishing costs. In this study, we quantitatively investigated the degradation behavior of ceria-based abrasive slurry in glass polishing.…
4H-SiC is considered one of the most promising next-generation semiconductor materials. Therefore, flattening methods of 4H-SiC and their mechanism have been widely studied in recent years. Although the generation of different types of step-terrace structure of 4H-SiC has been widely reported, their generation mechani…
In semiconductor industry, wire bonding is often one of the bottleneck processes. This has posed a tremendous challenge in the wire bond interconnect technology to reduce the assembly cycle time and cost of ownership. Nevertheless, long-life capillary is one of the key factors to the success of advanced wire bonding s…
The purpose of this paper is to investigate the effect of diamond grit during chemical mechanical polishing (CMP) process. CMP is the most important for planarization of wafer surface in semiconductor manufacturing. During polishing process, the wafer surface and the pad are contacted with the slurry. There are variou…
This paper presents several aspects regarding the surface preparation for obtaining wearable devices (sensors embedded in the textile structure). For the electronic devices (OLED, PV, sensors and actuators) deposition it is very important to have a compact woven structure with antistatic, hydrophobic and oleophobic ch…
Cd0.9Zn0.1Te ingots were synthesized from pure components (6N purity Cd, Zn, Te, with In and Fe as dopants) and subsequently grown from the melt under an argon overpressure. Graphite crucibles (with and without an inner coating of pyrolytic BN) were used. The temperature gradient in the solidification zone was ∼15–30…
Cadmium Telluride (CdTe), one of II-VI group compound semiconductors, was used as a material of X-Ray detector, since it has good features of high absorption rate and high conversion efficiency of X-Ray, resulting from its excellent electric properties. However, a rough surface of the CdTe thin-film causes a delay of…
This is a chronicle of the sol-gel auto combustion synthesis of ZnO: K nano grains along with the structural and optical properties. The XRD patterns confirm the substitution of K atoms into ZnO lattice. The grain size, lattice constants and volume are estimated from the XRD patterns. The morphology of the samples are…
Electricity is a form of energy that can be easily transformed into other energy forms. The purpose of this study is to analyze the chitosan-lithium battery cells. It is found that the energy of chitosan-lithium battery cells will give decreases with the decreasing of given discharge current at a very small percentage…
Abstract The modern scanning transmission electron microscope (S/TEM) has become a key technology and is heavily utilized in advanced failure analysis (FA) labs. It is well equipped to analyze semiconductor device failures, even for the latest process technology nodes (20nm or less). However, the typical sample prepar…
The alumina (Al2O3) with different morphologies have great interest due to their potential use in various technological areas such as as-catalysis, batteries, solar energy conversion, gas sensing and field emission. In this work, nanostructured Al2O3were prepared by a solution-phase method in the presence of ethylene…
Corrosion is an important issue during chemical mechanical polishing (CMP). The surface protection should be considered during CMP and also after CMP post cleaning step. There are several parameters have an impact on corrosion of metal surfaces during CMP such as chelating agent (AC), corrosion inhibitor (I) and pH. E…
Advanced liner materials are crucial for optimizing and further shrinking of integrated circuits' interconnects. For next generation devices there is a focus on Cobalt (Co) and Ruthenium (Ru) [1]. Besides the challenges to deposit such materials, new chemical-mechanical polishing (CMP) process compatibility is needed.…
Abstract The case study in this paper describes how collaboration between customer design and test teams and a thorough FAB investigation triggered by a detailed electrical analysis using the Atomic Force Nanoprober (AFP) resulted in the effective resolution of a challenging implant related issue on LDMOS structure th…
The aim of the paper is to characterize the distribution of the electromagnetic field inside and near the solenoid multiturn antenna, respecting the requirements of Ion Chiricuta Oncological Institute laboratory. We will also measure the antenna parameters. Also, we will present some practical results from the common…
SF6 gas has been adopted asan alternative of air for insulation technology in modern day industry due to its high dielectric strength and arc quenching properties. In the recent past, electrical substations are employing gas insulation because of its better properties and also lower space requirement. One of the major…