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W CMP for C14nm and Beyond: Barrier selective approach

C. Euvrard、A. Seignard、V. Balan 等 6 位作者2014-11-01OpenAlex

Beyond C14nm, better W CMP performances are required due to new CMOS integration constraints such as contact density increase, wide W feature introduction or low oxide loss for any polishing steps related to gate building. In order to address these new requirements, this paper propose an approach similar to Cu damasce…

Semiconductor materials and devicesAdvanced Surface Polishing TechniquesCopper Interconnects and Reliability

Quantitative Analysis of Heterogeneous Materials by SEM/EDS by Use of Rapid Phase Decomposition

J. Konopka2014-11-01Proceedings - International Symposium for Testing and Failure Analysis

Abstract Algorithms for quantification by SEM/EDS always specify that the material being analyzed should be homogeneous. Every instruction on analysis by SEM/EDS warns against analyzing heterogeneous samples. However, in day-to-day analysis, it is extremely common to encounter samples which are heterogeneous and these…

Nuclear Physics and ApplicationsElectron and X-Ray Spectroscopy TechniquesNon-Destructive Testing Techniques

review on bulk diffusion in metallic solids

Amitava Ghorai2014-11-01Diffusion fundamentals.

In this paper bulk diffusion techniques in case of metals and alloys will be reviewedwith a special emphasis on resistometric technique. The experiment is restricted only to those metals, which can be made in the form of wire but has the advantage of applying to materials whose suitable radioactive isotopes are not av…

Fusion materials and technologiesNuclear Materials and PropertiesThermodynamic and Structural Properties of Metals and Alloys

CMP process development for Cu/low-k with Ru liner

BoUn Yoon2014-11-01OpenAlex

As the design rule of BEOL of the device decreases, it becomes difficult to obtain void-free Cu fill with the conventional PVD barrier metal (TaN/Ta). To increase Cu gap-fill performance, CVD liners such as Co and Ru have been extensively developed. Among them, Ru liner has a great potential for the next generation Cu…

Electrodeposition and Electroless CoatingsCopper Interconnects and ReliabilityNanoporous metals and alloys

A Lowpass Pulsed Excitation and Method for Polarization Resistance Measurements

Gerardo León、Rafael Magallanes‐Quintanar、Arturo Moreno-Báez 等 5 位作者2014-11-01OpenAlex

A new method to measure the polarization resistance on electrochemical cells is proposed. The method is based on the application of a new pulsed excitation, which exhibits low pass frequency contents, and time domain analysis. In other pulsed excitation methods, curve fitting algorithms are used to find values for equ…

Conducting polymers and applicationsElectrochemical Analysis and ApplicationsAnalytical Chemistry and Sensors

Al-Cu Alloy Films Characterization and Studies Using TOF-SIMS, XPS, AFM, EBSD and TEM

Jianshuai Shao、Youqing Shen、Yuehong Shen 等 12 位作者2014-11-01Proceedings - International Symposium for Testing and Failure Analysis

Abstract Aluminum-copper alloys are popular for many applications that take advantage of the combination of properties in the alloys. This paper describes the use of multiple advanced failure analysis tools to analyze the physical and chemical properties of Al-Cu alloy thin films.

Metal and Thin Film MechanicsAluminum Alloy Microstructure PropertiesCopper Interconnects and Reliability

New line-starting method of synchronous motors not having damping windings

N. Debbah、R. Ibtiouen、Yacine Amara2014-11-01OpenAlex

An original line-starting method for a synchronous machines, which do not have damping windings, is investigated in this paper. A general overview of line start synchronous machines is first presented. Problems related to the line-starting of synchronous machines is first presented. The new line starting method is inv…

Electric Motor Design and AnalysisMagnetic Properties and ApplicationsMagnetic Bearings and Levitation Dynamics

The oxidant impact for Tungsten polishing

Koichiro Hosokawa、Shöichirö Yoshida、Yoshiharu Ota2014-11-01OpenAlex

In recent years, further improvement in planarization at Tungsten (W) Chemical Mechanical Planarization (CMP) is becoming increasingly important at advanced technology nodes. A combination of hydrogen peroxide and metal catalyst has mainly been used as the W slurry components. On the other hand, these components which…

Advanced Surface Polishing TechniquesCopper Interconnects and ReliabilityElectrical Contact Performance and Analysis

THE USE OF NON-CONVENTIONAL TECHNOLOGIES IN IMPROVING THE LIFE OF AIR WHEELS PRESENT LT

Peter Mrva、Dávid Kašper2014-11-01Acta Avionica

This paper presents a proposal to increase the life of the air wheel refurbishment and wheel drum aviation technology using thermal plasma spraying. As the aircraft wheels during operation subject to extreme stress is necessary to ensure their proper operation and adequate maintenance. In many cases, the wheel wear oc…

Material Properties and ApplicationsSurface Treatment and CoatingsTechnical Engine Diagnostics and Monitoring

DESIGN OF AN ALL-COMPOSITE WING FROM CARBON FIBERS FOR SMALL TRANSPORT AIRCRAFT WITH MAXIMUM TAKEOFF WEIGHT UP TO 2000 KG

Martin Jurčovič2014-11-01Acta Avionica

Objective of this thesis is design of an all-composite wing from carbon fibers for small transport aircraft with maximum takeoff weight up to 2000 kg. The basic building formula is a certification specification CS 23. The thesis carries calculation of basic aerodynamic analysis of wing and its load. Furthermore is a r…

Material Properties and ApplicationsMechanical and Thermal Properties Analysis

Ti/STS 이종 금속 판재의 계면 연계 물성에 미치는 열처리 영향

조유미、이광석、강남현 等 4 位作者2014-11-01대한금속재료학회지

We investigated effects of annealing conditions on the interface-correlated microstructural evolution and subsequent mechanical properties of a Ti/STS439 clad sheet. The evolution of the interface microstructure was first analyzed with optical microscopy, scanning electron microscopy, transmission electron microscopy,…

Intermetallics and Advanced Alloy PropertiesTitanium Alloys Microstructure and PropertiesMaterial Properties and Applications

Metal Bridge Defects Localization by a Tiny Leakage between One of Bridged Signals and VDD (GND)

Chunlei Wu、Suying Yao2014-11-01Proceedings - International Symposium for Testing and Failure Analysis

Abstract As semiconductor technology continues to advance to smaller dimensions and more complex circuit designs, it is becoming more challenging to locate the resistive short directly between two metal lines (signals) due to a metal bridge defect. Especially these two metal lines are very long and relevant to many fu…

Electron and X-Ray Spectroscopy TechniquesIndustrial Vision Systems and Defect DetectionIntegrated Circuits and Semiconductor Failure Analysis

MicroPREP—A New Laser Tool for High-Throughput Sample Preparation

Michael Krause、Martin A. Ebert、Thomas Höche 等 4 位作者2014-11-01Proceedings - International Symposium for Testing and Failure Analysis

Abstract Over the past fifty year, lasers have found many, often groundbreaking applications in science and technology. The most important features of lasers are that photons are inherently free of contamination, extremely high energy densities can be focused in very small areas and the laser beam can be precisely pos…

Laser Material Processing TechniquesElectron and X-Ray Spectroscopy TechniquesIntegrated Circuits and Semiconductor Failure Analysis

Talisman secures Sinclair

Dominic Piper2014-11-01Australia's Paydirt

The rejuvenation of the West Australian nickel scene continues with junior explorer Talisman Mining Ltd announcing in late October it had struck agreement with Glencore Xstrata to acquire its Sinclair nickel mine.

Mining and Resource ManagementMetallurgy and Material Science

A2/O-MBR碳源优化及膜可持续临界通量研究

徐荣乐2014-11-01Research Center for Eco-Environmental Sciences OpenIR (Chinese Academy of Sciences)

A2O-MBR工艺在我国城市污水处理厂的提标改造中具有出水水质好,占地面积小等优势,目前已在我国有了较多应用,然而A2O-MBR在应用中存在着产 水量难以保证和在碳源缺乏条件下氮磷水质指标难以达标的双重问题。本文针对A2/O-MBR系统存在的碳源缺乏导致氮磷处理水质不达标,膜污染导致膜通量 衰减使MBR污水厂处理规模在运行一定时期后难以保证的问题,以生活污水为处理对象,开展A2/O-MBR碳源优化及可持续通量的研究,为我国城市污水处 理厂的提标改造,确立A2/O-MBR污水处理厂的可持续通量,保证稳定的处理规模提供科技支撑。 \n 针对我国城市生活污水存在C/N偏低,需要添加碳源以提高出水水质的现状,考察了外碳源(甲醇和乙酸钠)和…

Wastewater Treatment and Nitrogen RemovalPhosphorus and nutrient managementMagnesium Oxide Properties and Applications

Failure Localization of Intermittent Short Failures Caused by Vertical Conductive Anodic Filament Formation

Daniel Nuez、Phoumra Tan2014-11-01Proceedings - International Symposium for Testing and Failure Analysis

Abstract Conductive anodic filament (CAF) formation is a mechanism caused by an electrochemical migration of metals from a metal trace in ICs or in PCBs. This is commonly caused by the moisture build-up in the affected metal terminals in an IC package or PC board caused by critical temperature, high humidity and high…

Electronic Packaging and Soldering TechnologiesElectron and X-Ray Spectroscopy TechniquesIntegrated Circuits and Semiconductor Failure Analysis

Identification of Subtle Defect by Means of High Kev SEM Passive Voltage Contrast

Sujing Xie、Chaoying Chen、Nathan Wang 等 6 位作者2014-11-01Proceedings - International Symposium for Testing and Failure Analysis

Abstract This paper presents two cases utilizing high KeV Passive Voltage Contrast (PVC) for defect localization that is impossible with other techniques. The first case is thin layer resistor of CrSi. De-processing or polishing to expose the defective layer may damage it. High KeV PVC combined with FIB etch allows fo…

Electron and X-Ray Spectroscopy TechniquesIndustrial Vision Systems and Defect DetectionIntegrated Circuits and Semiconductor Failure Analysis

A Comprehensive Investigation of the Galvanic Corrosion Induced Ag-Al Bond Degradation in Microelectronic Packaging Using Argon Ion Milling, SEM, Dual Beam FIB-SEM, STEM-EDS, and TOF-SIMS

Yixin Chen、E. Simon、Bing Sheng Khoo 等 9 位作者2014-11-01Proceedings - International Symposium for Testing and Failure Analysis

Abstract In this study, a comprehensive investigation of the Ag-Al bond degradation mechanism in an electrically failed module using the argon ion milling, scanning electron microscopy (SEM), dual beam focused ion beam-SEM, scanning transmission electron microscopy energy dispersive x-ray spectroscopy, and time-of-fli…

Corrosion Behavior and InhibitionElectron and X-Ray Spectroscopy TechniquesIntegrated Circuits and Semiconductor Failure Analysis