Materials Literature
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Οι υψηλές θερμοκρασίες λειτουργίας των κελιών καυσίμου στερεού ηλεκτρολύτη (Solid Oxide Fuel Cells - SOFCs), οδηγούν σε σημαντική επιβάρυνση των σημείων συνένωσης και στεγανότητας των στοιχείων των επί μέρους εξαρτημάτων των κελιών, που διατάσσονται σε στοιβάδες. Στα σημεία συνένωσης και εναλλακτικά στα μέχρι σήμερα χ…
Zur wirtschaftlichen Herstellung von industriell gefertigten Betonbauteilen werden geringe Taktzeiten angestrebt, um die Formen und Schalungen moeglichst schnell wiederverwenden zu koennen. Dafuer ist es notwendig, dass der Beton eine hohe Fruehfestigkeit entwickelt, um die noetige Ausschalfestigkeit zu erreichen. Um…
Honors (Bachelor's)
Faculty advisers: Bharat Jalan, Chris Leighton
You know the drill: lotsa pretty pix, not much yap. Our first stop of the day was the Fruita Paleontological Area, which has a fanstastic diversity of Morrison animals, including the mammal Fruitafossor and the tiny ornithopod Fruitadens . Plus it's a pretty epic landscape, especially with the clouds and broken light…
ABSTRACT This paper discusses the lead (Pb) free alloy qualification through mechanical vibration testing. With the RoHS directives prohibiting the use of hazardous substances, electronics manufacturers are moving away from alloys containing Pb. Environments in the aerospace industry are particularly harsh and the pro…
ABSTRACT In the present work, the effect of reflow time on wetting behaviour, interfacial reactions and growth of intermetallic compounds (IMCs) were investigated for Sn-0.3Ag-0.7Cu lead free solder alloy on Cu substrate during reflow at 270°C. The reflow time was varied from 10s to 10000s. The contact angle decreased…
ABSTRACT With increasing airborne pollution levels in several parts of the world and decreasing spacing of components in electronic assemblies and lead free soldering, the corrosive effects of the pollutants on modern electronics is becoming more apparent. The standard test for this has been the mixed flowing gas test…
ABSTRACT Driven in part by European Union directives, most commercial electronics manufacturers began a global movement away from using lead (Pb). Component manufacturers are increasingly applying tin-rich finishes to the leads of their devices and soldering with lead (Pb)-free solders. Unfortunately, this can create…
ABSTRACT The dominant lead-free solder alloy used by the high performance segment of the electronics industry is the Tin (Sn) - Silver (Ag) - Copper (Cu) family. The SAC305 solder alloy has acceptable thermal cycle properties but a number of other characteristics such as copper dissolution rate and drop shock resistan…
ABSTRACT The solder balls attach of two water-soluble solder pastes, a novel zero halogen material and a halogenated material, was compared in nitrogen and air atmospheres after reflow in a Malcom Reflow Simulator. Videos of the reflow process showed that both pastes reflowed well in nitrogen. After air reflow the zer…
ABSTRACT It has been shown in studies that simple SAC based alloys under high delta thermal cycle conditions can be less reliable than traditional tin-lead alloys. This limitation has prevented their widespread adoption for use in high reliability and harsh environments. One approach to overcome this limitation is to…
ABSTRACT Various quad-flat no-lead (QFN) packages, land grid arrays (LGA) and ball grid arrays (BGA) are being combined on a number of products with ever increasing component densities and complexities. The bottom terminated component’s (BTC) small footprint, low cost, and excellent electrical as well as thermal perfo…
ABSTRACT Manufacturers of automotive electronics are very concerned with reliability, as the devices they assemble will be used in harsh environments and many must function reliably for the safe operation of the vehicles in which they are installed. For this reason, automotive circuits are often treated with conformal…
ABSTRACT In this paper, we present details of a very systematic study undertaken for the development of lead-free and RoHS compliant alloy for high operating temperature applications. Currently, Innolot is one of the most suitable alloy for such ultra-high reliability requirements, such as, Automotive and high CTE mis…
ABSTRACT Because of the expectation that the current exemption from the EU RoHS Directive for solders with more than 85% Pb will not be extended beyond 2016, the identification of a practicable lead-free alternative to high-lead high-melting-point solders has been one of the most urgent challenges for the electronic c…
ABSTRACT This paper is focused on the microstructure and hardness analysis of new bismuth (Bi) containing alloys that have lower melting and process temperature than the conventional SAC305 solder alloy. One of the main SAC solder drawbacks is fast coarsening of microstructure resulting in degradation of the mechanica…
ABSTRACT As consumer electronics play an ever increasing role in our daily lives, the content they hold becomes more valuable and vulnerable than ever. With personalised content such as photos, e-mails, apps, and contacts - along with an increasing amount of financial data with the introduction of the e-wallet and nea…
ABSTRACT The present research systematically investigates the testing conditions for electromigration (EM) tests and compares the EM resistances of Sn58Bi (SB, in weight percent)-based solders including SB, Sn58Bi0.5Ag (SBA), and Sn58Bi0.5Ag0.1Cu0.07Ni0.01Ge (SBACNG) solders. With the contribution of a 2D Cu/solder/Cu…
The purpose of this work was to investigate the behavior of different cement-based fill materials for the annulus of pipeline casings. The experimental work focused on their effects on cathodic protection and alternating current interference. The results are discussed with respect to implications for material selectio…