Materials Literature
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Cover: The determination of critical pitting temperatures (CPTs) in specific test media is a common testing method for the pit‐ting corrosion resistance of high alloyed materials. Com‐monly used test solutions for high alloyed steels like the ferric chloride test (ASTM G48) or the “Green Death” test have limitations u…
Significance and Use 5.1 The test results represent afterflame plus afterglow time, in seconds, for a material under the conditions of the test. The test results for plaques also indicate whether or not the specified flame will burn through a material. 5
The determination of critical pitting temperatures (CPTs) in specific test media is a common testing method for the pitting corrosion resistance of high alloyed materials.Commonly used test solutions for high alloyed steels like the ferric chloride test (ASTM G48) or the ''Green Death'' test have limitations using the…
Established in 1964, the IUCN Red List of Threatened Species has evolved to become the world’s most comprehensive information source on the global conservation status of animal, fungi and plant species.
This work investigates structure analysis and design of metal interconnects for stretchable electronic circuits using the finite element software ABAQUS. In order to design a more promising structure of metal interconnect, the performance of different parameters (the inner radius, the angle and the width of the copper…
ULSI circuits are constantly improved by continuous scaling down the character sizes. Copper connections and the ultralow-k (ULK) materials as inter-layer dielectrics (ILD) and inter-metal dielectrics (IMD) were implemented. Therefore, the chip package interaction (CPI) becomes critical due to the mechanical propertie…
Different diffusion behavior of Cu, Ni and Zn atoms in Cu/Sn-9Zn/Ni interconnects during liquid-solid electromigration (L-S EM) were investigated under a current density of 5.0 × 103A/cm2at 230oC. When Cu atoms were under downwind diffusion, L-S EM enhanced the cross-solder diffusion of Cu atoms to the opposite Ni sid…
This specification covers low velocity projectile (LVP) markers that eject a low velocity resilient material (LVRM) projectile using compressed air, compressed gas, or a combination of both. Included in this specification are performance requirements and test methods for LVP markers as well as the minimum warnings and…
This specification covers extruded and cast sheet, plate, rod and tubular bar manufactured from nylon or monomers. Requirements necessary to identify particular characteristics important to specialized applications may be described by using the given classification system. The use of recycled plastics is allowed in th…
This specification covers critical characteristics of low velocity resilient material projectiles made from a resilient material. Material diameter, shape, projectile hardness, and weight shall conform to the dimensions indicated in this specification. This specification establishes minimum warning information, instru…
This specification covers general requirements for flat-rolled stainless and heat-resisting steel plate, sheet, and strip. The steel shall be made by one of the following processes: electric-arc, electric-induction, or other suitable processes. Heat and product analyses shall conform to the chemical requirements for e…
The vibrational mechanical properties of a graphene resonator were investigated by finite element analysis (FEA) modeling and simulation. By applying a pressure difference across the membrane, the natural frequency of the graphene sheets is changed. The resonance frequency increases with increasing pressure difference…
Significance and Use 4.1 Lamination factor, S, indicates the deficiency of effective steel volume which is due to the presence of oxides, roughness, insulating coatings, and other conditions affecting the steel surface. 4.2 The term Lamination Factor, S,
For real solder joints used in electronic devices, EM and creep may be two relevant reliability problems because solder joints usually serves under a combination of current stressing, elevated temperatures, and mechanical loading conditions. Especially when the size of solder joints scales down and current density esc…
This specification covers austenitic stainless steel forgings for pressure and high temperature parts such as boilers, pressure vessels, and associated equipment. The grades covered here are F304, F304H, F304L, F304N, F304LN, F309H, F310, F310H, F316, F316H, F316L, F316N, F316LN, F321, F321H, F347, F347H, F348, F348H,…
Section A of Acta Crystallographica publishes articles reporting advances in the theory and practice of all areas of crystallography and structural science in the widest sense.As well as traditional crystallography, this includes nanocrystals, metacrystals, amorphous materials, quasicrystals, synchrotron and XFEL stud…
This specification covers the general requirements for hot-rolled steel strip in coils and cut lengths. It applies to carbon steel and high-strength, low-alloy steel furnished as hot-rolled. Hot-rolled material shall be furnished hot-rolled, not annealed, or pickled. The chemical composition shall be in accordance wit…
The properties of two new compounds developed at the Institute of Physical Chemistry of the Polish Academy of Sciences in Warsaw enable faster, low cost manufacturing of thin OLED films.
Professor Chintamani Nagesa Ramachandra Rao, world-wide known as C. N. R. Rao, was born on June 30, 1934 in Bangalore, India. His academic and professional career has been undoubtedly shaped by numerous influences, though a few institutions stand out due to their deeper associations with him over the years. While he w…
Thermal interface materials (TIMs) which consist of metal foil and soft cushion are used in the process of chip processor platform validation (PPV) process, and some defects, such as the stains caused by debris peeled off from TIMs due to stress concentration, were found on the surface of the chips and they had an haz…