Materials Literature
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Thermal interface materials (TIMs) which consist of metal foil and soft cushion are used in the process of chip processor platform validation (PPV) process, and some defects, such as the stains caused by debris peeled off from TIMs due to stress concentration, were found on the surface of the chips and they had an haz…
In this paper, multilayer ceramic board design about the POP ceramic package is studied Stripline design such as signalline, electrical wire, offset is optimized with software such as Cadence and HFSS. Signalline transfers loss is obtained as 0.35dB/2GHz (25mm), electromagnetism isolation larger than 70dB. The complex…
Electromigration (EM) in solder joints under high current density has become a critical reliability issue for the future high density microelectronic packaging. A practical method of atomic density integral (ADI) for predicting solder bump electromigration reliability is proposed in this paper. The driving forces elec…
Scope 1.1 This specification covers cold-formed electric resistance or electric induction welded carbon structural steel tubing in round, square, rectangular, or special shapes that are zinc-coated (galvanized) on the exterior surface only, in continuous
This specification covers centrifugally cast ferritic/austenitic steel pipe intended for general corrosive service. These steels are susceptible to embrittlement if used for prolonged periods at elevated temperatures. The pipe shall be made by centrifugal casting process and furnished in the specified heat-treatment c…
Significance and Use 4.1 The tensile and impact properties, the weldability, and the corrosion resistance of iron-chromium-nickel alloy castings may be influenced beneficially or detrimentally by the ratio of the amount of ferrite to the amount of austeni
The synthesis of diamond has been a dream of mankind since the 19th century when it was discovered that diamond is an allotrope of carbon. It was from this time that scientists eagerly tried to find an approach for conversion of the stable form graphite into the metastable form diamond. The first successful approach i…
This specification covers the common requirements that shall apply to wrought steel piping fittings. The material shall consist of forgings, bars, plates, and seamless or welded tubular products. Ferritic steels shall be fully killed. Hollow cylindrically shaped parts up to and including NPS 4 may be machined from bar…
Ceramic column grid array (CCGA) modules are an extension of the ceramic ball grid array (CBGA) packages. CCGA packages are becoming increasingly popular as an alternative to Ceramic Ball Grid Array CBGA packages for applications requiring very high-density interconnections with higher board-level reliability. CCGA pa…
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Significance and Use 4.1 This test method is used for the calibration of a block-on-ring testing machine by measuring the friction and wear properties of a calibration fluid under the prescribed test conditions. 4.2 The user of this test method should de
Plastics Engineering is the official publication of the Society of Plastics Engineers (SPE). We provide plastics professionals with a wealth of information about machinery, technological advances, materials innovations, sustainability, and more.
This specification covers high magnesium marine application aluminum-alloy in those alloy tempers for flat sheet, coiled sheet, and plate, in the mill finish that are intended for marine and similar environments. An inspection lot shall consist of an identifiable quantity of material of the same mill form, alloy, temp…
In our study, three different silane coupling agents with various functional groups, (y-aminopropyl) triethoxysilane (KH550), γ-(2,3-epoxypropoxy) propytrimethoxysilane (KH560) and trimethoxyoctadecylsilane (TMOS) were added into the SiO2/epoxy composites respectively, and their effects on the rheological and thermome…
Nanotechnology is an emerging/enabling technology and of utmost importance. Two main approaches are used in nanotechnology. In the bottom-up approach, materials and devices are built from molecular components that assemble themselves chemically by principles of molecular recognition. In the top-down approach, nano-obj…
With the advent of lead-free soldering electronic packaging industry, there are growing concerns regarding the problems of voids in lead-free solder joints. Many researchers are eager to understand the growth, evolution and control factors of bubbles. Due to the restrictions in test conditions imposed by high temperat…
A quantum-information analogue of the transistor has been unveiled by two independent groups in Germany and the US.
Recently, it was demonstrated that electrospinning can produce superfine fiber ranging from micrometer to nanometer using an electric field force. In the electrospinning process, a strong electric field is applied between polymer solution contained in a syringe with a capillary tip and grounded collector. When the ele…
Article Experimental Thermodynamics—Volume IX: A, Advances in Transport Properties and B, Non-Equilibrium Thermodynamics and Applications was published on May 1, 2014 in the journal Chemistry International (volume 36, issue 3).
Defects could be inevitably generated during the growth or the artificial operation of graphene. The existence of structure defects could be influence to excellent properties of graphene. Non-equilibrium molecular dynamics (NEMD) simulations was used to investigate the thermal conductivity of graphene with single vaca…