作者信息未提供2014-05-01physica status solidi (b)
physica status solidi (RRL) -Rapid Research Letters (www.pss-rapid.com) is presently the fastest peer-reviewed publication medium in solid state physics.It communicates important fi ndings with a high degree of novelty and need for express publication, as well as other results of immediate interest to the solid state…
Solid-state spectroscopy and crystallography
Liang‐Wen Ji、Xiangmeng Jing、Kai Xue 等 6 位作者2014-05-01OpenAlex
Though Silicon Vias(TSVs) are regarded as a key technology to achieve three dimensional(3D) integrated circuit(IC) functionality. Annealing a silicon device with TSVs may cause high stress and cause TSV protrusion because of high Coefficient of Thermal Expansion(CTE) between silicon substrate and TSVs. The TSV wafers…
Semiconductor materials and devicesAdvancements in Semiconductor Devices and Circuit DesignCopper Interconnects and Reliability
作者信息未提供2014-05-01Macromolecular Rapid Communications
Front Cover
Quantum Dots Synthesis And PropertiesSupramolecular Self-Assembly in MaterialsSilk-based biomaterials and applications
Guo Kun、Zeng Xiaoliang、Yu ShuHui 等 5 位作者2014-05-01OpenAlex
Curing mechanism and thermal properties of a certain liquid crystalline epoxy resin (LCER), 4,4'-bis(4-hydroxybenzoyloxy)-3,3',5,5'-tetramethyl biphenyl (DGE-BHBTMBP) cured with three different curing agents 4,4'-diaminodiphenylsulphone (DDS), biphenyl diamine (BPDA), dihydroxybiphenyl (DOD) were investigated. Curing…
Liquid Crystal Research AdvancementsEpoxy Resin Curing ProcessesSynthesis and properties of polymers
作者信息未提供2014-05-01Molecular Therapy
John Nemunaitis,1,2,3,4,7 Minal Barve,1,3 Zhaohui Wang,4,7 F.C. Brunicardi,6 Nancy S. Templeton,4,7 Neil Senzer,1,4,7 Padmasini Kumar,4 Gladice Wallraven,4 Chris M. Jay,4,7 Joseph Kuhn,5 Peter Beitsch,2 Robert G. Mennel,3 Haskell M. Kirkpatrick,3 Douglas Orr,3 Scott Stone,3 Tammy Roque,3 Phillip B. Maples,4 Donald D.…
MicroRNA in disease regulationNanoparticle-Based Drug DeliveryRNA Interference and Gene Delivery
A01 Committee2014-05-01OpenAlex
This specification covers carbon steel castings for valves, flanges, fittings, or other pressure-containing parts for high-temperature service and of quality suitable for assembly with other castings or wrought-steel parts by fusion welding. Covered here are three grades of carbon steel (Grades WCA, WCB, and WCC), the…
Microstructure and Mechanical Properties of SteelsWelding Techniques and Residual StressesMetal Alloys Wear and Properties
作者信息未提供2014-05-01physica status solidi (b)
Theoretical studies based on density functional theory (DFT) describe the changes in molecular and electronic structures during the super-reduction of the Mn 12 cluster by the uptake of eight excess electrons in the gas phase. The results agree largely with experimental observations obtained in a molecular cluster bat…
Boron and Carbon Nanomaterials ResearchInorganic Chemistry and MaterialsThermal Expansion and Ionic Conductivity
British Gas2014-05-01OpenAlex
Refractoriness Cone 28-31 32-34 29-31 31-33 35-36 38 DC 1630-1700 1710-1750 1650-1690 1690-1730 1770-1790 1850 Refractoriness under load 1440-1520 1550-1620 1550-1600 1660-1700 1700 1500-1700 193 kN/m2 DC Cold crushing MN/m2 17.2-37.9 13.8-37.9 34.5-48.3 20.7-34.5 strength Thermal W/(mK) 1.1 1.1 1.2 2.4 3.6 conductivi…
Material Properties and Applications
Xu Yanjun、Lin Huang、Guang Chen 等 6 位作者2014-05-01OpenAlex
NiCu is one of the widely used thin-film materials, which is now commonly used as sensor and resistor in very-large-scale-integration (VLSI) because of its high resistivity and stability. However, with the scale decreasing and the temperature increasing in service condition, the limited reliability of NiCu thin-film m…
Electronic Packaging and Soldering TechnologiesElectrodeposition and Electroless CoatingsCopper Interconnects and Reliability
Cheng Huang、Sheng Liu、Jianping Zhu 等 5 位作者2014-05-01OpenAlex
This paper proposed a novel modeling of the TSV MOS capacitance by finite difference (FD) method without the assumption of the full depletion approximation (FDA). The potential distribution in the oxide liner and depletion region can be obtained by FD with only one iteration. With the potential distribution, the TSV c…
Semiconductor materials and devices3D IC and TSV technologiesCopper Interconnects and Reliability
Mingliang Huang、Zhijie Zhang、Ning Zhao 等 4 位作者2014-05-01OpenAlex
Synchrotron radiation real-time imaging technology was conducted to in situ observe the interfacial reaction in line-type Cu/Sn-9Zn/Ni interconnect under a current density of 2.0 × 104A/cm2at 230 °C. The reverse polarity effect in Cu/Sn-9Zn/Ni interconnects undergoing L-S EM was verified by the continuous growth of th…
Electronic Packaging and Soldering TechnologiesElectrodeposition and Electroless CoatingsCopper Interconnects and Reliability
A01 Committee2014-05-01OpenAlex
This specification deals with the general requirements that apply to rolled structural steel bars, plates, shapes, and sheet piling. The steel shall be made in an open-hearth, basic-oxygen, or electric-arc furnace followed by additional refining in a ladle metallurgy furnace, or secondary melting by vacuum-arc remelti…
Microstructure and Mechanical Properties of SteelsMetal Forming Simulation TechniquesMetal Alloys Wear and Properties
作者信息未提供2014-05-01Alloy Digest
Abstract CSS-42L is a stainless steel containing good contents of cobalt and molybdenum. It can be case hardened to very high levels while maintaining good interior toughness and ductility. This datasheet provides information on composition and physical properties as well as fracture toughness. It also includes inform…
Material Properties and ApplicationsMechanical Failure Analysis and Simulation
作者信息未提供2014-05-01OpenAlex
Creating ALD and CVD precursors through innovation and partnershipALOHATM offers an attractive mix of generic and specialty precursors for High-k capacitor & Gate dielectric, BEOl dielectrics, Spacer, Gap-fill, Patterning, Advanced Metals, New memories and others.
Semiconductor materials and devicesCopper Interconnects and ReliabilityFerroelectric and Negative Capacitance Devices
Shan Yang、Li Peng、Yishi Tao 等 5 位作者2014-05-01OpenAlex
The copper substrates with different preferred orientations (200) and (220) were prepared and the interfacial reactions of the Cu(200)/Sn and Cu(220)/Sn diffusion couples were studied after annealing at 423K. The thickness and morphology of the intermetallic compounds were investigated. The appearance of the Cu3Sn was…
Electronic Packaging and Soldering TechnologiesAdvanced Welding Techniques AnalysisCopper Interconnects and Reliability
Guang Chen、Fengshun Wu、Weisheng Xia 等 5 位作者2014-05-01OpenAlex
In this paper, Ni-coated graphene nanosheets (GNS-Ni) were synthesized by an in situ chemical reduction method. Such GNS-Ni sheets, by varying their weight fractions (0.05, 0.1 and 0.2wt.%) were successfully incorporated into the SAC305 solder matrix to fabricate composite solders through the powder metallurgy process…
Graphene research and applicationsElectronic Packaging and Soldering TechnologiesMetallurgical and Alloy Processes
A01 Committee2014-05-01OpenAlex
This specification covers standards for iron-chromium and iron-chromium-nickel alloy castings of general purpose grades (Grades HF, HH, HI, HK, HE, HT, HU, HW, HX, HC, HD, HL, HN, and HN) applicable in heat-resistant services. Alloys shall be produced through electric arc, electric-induction, or other approved process…
Microstructure and Mechanical Properties of SteelsMetallurgical Processes and ThermodynamicsMetal Alloys Wear and Properties
GM Pearce、SH Lim、JH Sul 等 5 位作者2014-05-01Applied Mechanics and Materials
Collection of selected, peer reviewed papers from the Australasian Conference of Computational Mechanics 2013 (ACCM 2013), October 3-4, 2013, Sydney, Australia. The 139 papers are grouped as follows: Chapter 1: Advanced Materials and Multiscale Modelling, Chapter 2: Computational Fluid Dynamics and Thermofluids, Chapt…
Carbon Nanotubes in CompositesEpoxy Resin Curing ProcessesComposite Material Mechanics
Z. Yang、J. D. Long、X. H. Wang 等 10 位作者2014-05-01OpenAlex
The ion beam for vacuum arc ion source in sealed tube neutron generator owns some special features, such as multi-particle mixtures, high-intensity beams, short pulse-width, single gap acceleration system and eccentric beams. It is related to the design of the vacuum arc ion source and beam optics, which affect the in…
Metal and Thin Film MechanicsDiamond and Carbon-based Materials ResearchVacuum and Plasma Arcs
Zhao Dongliang、Gao Ling2014-05-01OpenAlex
In this paper, aluminum nitride ceramic with high thermal conductivity was prepared by gas sintering using nano-particle Y2O3as sintering aids. When the content of nano-particle Y2O3was 2-4%, the sintering temperature was 1810°C and the holding time was 3 hours, the thermal conductivity of aluminum nitride ceramic cou…
GaN-based semiconductor devices and materialsAdvanced ceramic materials synthesisAcoustic Wave Resonator Technologies