Materials Literature
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Significance and Use 5.1 This guide is intended to provide machinery maintenance and monitoring personnel with a guideline for performing filter debris analysis as a means to determine machine condition. Correlating the filter contaminants to ‘normal’ and
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This specification covers quenched and tempered vacuum-treated carbon and alloy steel forgings for pressure vessels, such as those used in reactor systems, specifically, vessel closures, shells, flanges, tube sheets, rings, heads, and similar parts. Steels shall be manufactured by basic electric-furnace process except…
Significance and Use 3.1 Metalworking may be divided into two general types of processes, metal deformation (such as rolling) and metal removal (such as grinding or cutting). This classification lists the various types of fluid and non-fluid materials use
Nanoporous metals fabricated by dealloying have been utilized in a wide variety of applications including catalysis, sensors and actuators as well as low temperature bonding. In this work, nanoporous copper (NPC) for low temperature bonding was prepared by selectively dissolving Zn atoms from the Cu-Zn alloy, and the…
In order to accommodate high thermal loading of single side heated (SSH) high energy density magnetic or alternate fusion plasma-facing components, robust thermal management and high heat flux removal (HHFR) approaches are essential to prevent thermal instability, thermal run-away or a thermal spiral towards component…
This specification covers electrical-fusion-welded steel pipe for high-pressure service at moderate temperatures. Heat treatment may or may not be required to attain the desired properties or to comply with applicable code requirements. An analysis of each mill heat of plate material shall be made, also, an analysis o…
The microcracking behavior of the IMC layer is investigated numerically, and the effect of the thickness of the IMC layer on the overall response and failure mode of the solder joint is studied using qualitative numerical simulations. The results show that the thicker IMC layer results in lower overall strength. When…
This specification covers test methods and performance requirements for loose-fill rubber playground-surfacing products and is intended to complement existing ASTM International standards for determining the shock attenuation and accessibility of
Significance and Use 5.1 The flame height and color (indicative of air-to-gas ratio) for a test flame have traditionally been specified in the individual test method. The energy content of the flame has also been addressed by reference to a specific suppl
A study was conducted to document and understand the pollutant emissions characteristics of high-velocity jet flames in a crossflow of air. Measured were unburned hydrocarbon, carbon monoxide, and NOx emission indices; the ratio of NO2 to NOx; and flame dimensions. Four fuels of differing sooting propensities were use…
The effect of electromigration (EM) on the tensile strength of Cu/Sn-9Zn/Cu solder interconnects was investigated under a current density of 5×103A/cm2at 150 °C. After aging and EM, the thickness of interfacial IMCs increased. The IMC layer at the cathode side was thicker than that at the anode side for the samples af…
Ag finish is a low cost and low resistant solution comparing with Au finish in electronic packaging. For the sake of application of Ag finish, the solder joint reliability with broad silver finish designs on PCB of packaging is studied. It is found that both finish structure and process affect the reliability. Electro…
Significance and Use 4.1 The significance and use of each test method will depend on the system in use and the purpose of the test method listed under Section 7. Use the most recent editions of the test methods.Scope 1.1 This guide provides information, w
Nanotwinned copper has been got widely attention in microelectronics because it simultaneously demonstrate high strength, high conductivity, superior thermal stability, which makes it a very promising candidate to replace the position of common copper in the next generation of IC and packaging materials. The redistrib…
Cover: The 19th European Symposium on Polymer Spectroscopy (ESOPS19), organized simultaneously as the 77th Prague Meeting on Macromolecules (PMM), took place in Prague on July 2013. The cover is selected from the article by Vera Cimrová and co-workers on page 141.
To Bridge LEDs' Green Gap, Scientists Think Small
The Affiliate Plan, established by the IEEE Board of Directors, enables individuals who are not members of the IEEE, but who have an interest in the field of plasma science, to join the IEEE Nuclear and Plasma Sciences Society. Admission as an affiliate requires only membership in a professional society listed. Affili…
Significance and Use 2.1 This practice is designed to locate the thinnest portions of the zinc coating on newly coated items (see Appendix X1). Variations in coating thickness can be due to the process by which the zinc is applied (hot dipped, electroplat
To realize low temperature thermocompression bonding for 3D packaging and integration is of great significance. This research focuses on Cu-Cu low temperature thermocompression bonding using nanoporous copper films (NPCf) as bonding layer. Cu-Zn alloy as the precursor alloy was fabricated on the ceramic substrate by m…