Materials Literature
按标题、摘要、年份、主题和来源检索公开元数据。结果保留作者、摘要、分类与原始来源链接。
The high dissipation of integrated circuits means serious problems for packaging and for the design of complex electronic systems. Another important area of research and development nowadays is the integration of sensors and micromechanical systems (MEMS) with electronic circuits. The original Successive Node Reductio…
Extending earlier work on a vibronic theory of the FA centers in alkali halides, the reorientation is now considered of an off-center Li+ impurity, either isolated or near an F center. We derive analytically periodic potential energy barriers between metastable reorientational off-center sites, the barriers hindering…
One of the crucial steps in the design of an integrated circuit is the minimization of heating and temperature non-uniformity. Current temperature calculation methods, such as finite element analysis and resistor networks have considerable computation times, making them incompatible for use in routing and placement op…
This paper presents the consideration of the presence and the influence of non-linear distortion of photo-acoustic measurement set-up on the results of thermal properties analysis for the multi-layer semiconductor structure. The authors propose a method which will eliminate such an influence.
The aim of this work is to develop a simple optical method for the visualization of the natural convection flow generated in an electronic system during its normal operation. The presented experimental set-up allows to reveal local refractive index changes in a phase objects. A fringe pattern is acquired, through the…
Thermoreflectance methods by picosecond pulse heating and by nanosecond pulse heating have been developed under the same geometrical configuration as the laser flash method by the National Metrology Institute of JAPAN, AIST. Using these light pulse heating methods, thermal diffusivity of each layer of multilayered thi…
This paper presents a study of accuracy issues in thermal modeling of high power LED modules on system level. Both physical as well as numerical accuracy issues are addressed. Incorrect physical assumptions may result in seemingly correct, but erroneous results. It is therefore important to motivate the underlying key…
This work introduces a thermoreflectance-based system designed to measure the surface temperature field of activated microelectronic devices at submicron spatial resolution with either a laser or a CCD camera. The article describes the system, outlines the measurement methodology, and presents validation results. The…
Galliumnitride has become a strategic superior material for space, defense and civil applications, primarily for power amplification at RF and mm-wave frequencies. For AlGaN/GaN high electron mobility transistors (HEMT), an outstanding performance combined together with low cost and high flexibility can be obtained us…
Modern CPUs with increasing core frequency and power are rapidly reaching a point where the CPU frequency and performance are limited by the amount of heat that can be extracted by the cooling technology. In mobile environment, this issue is becoming more apparent, as form factors become thinner and lighter. Often, mo…
The recent development of electric and electronic devices has been remarkable. The miniaturization of electronic devices and high integration are progressing by advances in mounting technology. As a result, the reliability of fatigue life has been prioritized as an important concern, since the thermal expansion differ…
The thermal response function given to a unit-step dissipation accurately characterizes the thermal system. Instead of the thermal response function the so-called structure function describing three-dimensional as the equivalent model of one-dimensional heat-spreading, created from the thermal response function with t…
The aim of this paper is to give a short review on cluster dynamics modeling in the field of atoms and point defects clustering in materials. It is shown that this method, due to its low computer cost, can handle long term evolution that cannot, in many cases, be obtained by Lattice Kinetic Monte Carlo methods. Indeed…
In recent years, interfacial fracture becomes one of the most important problems in the assessment of reliability of electronics packaging. Especially, underfill resin is used with solder joints in flip chip packaging for preventing the thermal fatigue fracture in solder joints. In general, the interfacial strength ha…
This paper presents a very straightforward method to compute the transient thermal response to arbitrary power dissipation profiles in electronic devices with multiple heat sources. Using cubic spline interpolation of simulated or measured unit power step response curves (Zth-functions), additional errors due to model…
We will describe the thermal performance of power semiconductor module, which consists of hetero-junction bipolar transistors (HBTs), for mobile communication systems. We calculate the thermal resistance between the HBT fingers and the bottom surface of a multi-layer printed circuit board (PCB) using a finite element…
In this paper the methodology and the results of creating temperature dependent battery models for ambient intelligence applications is presented. First the measurement technology and the model generation process is presented in details, and then the characteristic features of the models are discussed.
High linear voltage references circuitry are designed and implemented in TSMC 0.18$μ$m CMOS technology. Previous research has proposed the use of MOS transistors operating in the weak inversion region to replace the bipolar devices in conventional PTAT(proportional to absolute temperature) circuits. However such solut…
In this paper new characterization equipment for thermal interface materials is presented. Thermal management of electronic products relies on the effec-tive dissipation of heat. This can be achieved by the optimization of the system design with the help of simulation methods. The precision of these models relies also…
This work builds on the previous introduction [1] of a coupled experimental-computational system devised to fully characterize the thermal behavior of complex 3D submicron electronic devices. The new system replaces the laser-based surface temperature scanning approach with a CCD camera-based approach. As before, the…