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Copper metallization for ULSL and beyond

S. P. Murarka、Steven W. Hymes1995-01-01Critical reviews in solid state and materials sciences/CRC critical reviews in solid state and materials sciences

The investigation of copper for use as an interconnection metal in the ultra large-scale integration (ULSI) era of silicon integrated circuits has accelerated in the past several years. The obvious advantages for using copper to replace currently used Al are related to its lower resistivity (1.7 μΩ-cm vs. 2.7 μω-cm fo…

Copper Interconnects and ReliabilitySemiconductor materials and devicesSemiconductor materials and interfaces

Titelei

作者信息未提供1995-01-01Applied Rheology

Near-IR molar absorption coefficient for the OH-stretching mode of cis-9-octadecenoic acid and dissociation of the acid dimers in the pure liquid state

Makio Iwahashi、Masao Suzuki、Miros aw A. Czarnecki 等 5 位作者1995-01-01Journal of the Chemical Society Faraday Transactions

The molar absorption coefficient, εOH, at 1445 nm for the stretching mode of the unbonded OH in the carboxy group of cis-9-octadecenoic acid has been successfully determined by examination and correlation of both the absorbance at 1445 nm for a dilute CCl4 solution of the acid and the degree of dissociation, αo, of t…

Molecular spectroscopy and chiralityLiquid Crystal Research AdvancementsPhotochemistry and Electron Transfer Studies