Materials Literature
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With respect to the basic gas discharge physics, the rise time of an electron avalanche under nitrogen atmosphere results in a partial discharge signal bandwidth of several hundreds of MHz. However, in terms of high frequency properties, a rotating machine acts as a highly complex network. Mismatch of impedance and ot…
A comprehensive kinetic model for the thermal polymerization of styrene at temperature values between 250 and 350 °C, capable of calculating monomer kinetics, oligomer concentrations, and molecular weight and terminal double bond (TDB) distributions, is described. The model, based on the mechanism described in the fir…
The area and film thickness effects on the breakdown strength were examined for different polymer films at room temperature. Electrodes of four different diameters were used for this experimental work, which were in the range of 1/2 to 2 inches in diameter. Materials of various thickness used for this investigation we…
The local and cooperative dynamics of supported ultra-thin films (L = 4-170 nm) of poly(methyl methacrylate) was investigated by dielectric spectroscopy at frequencies from 0.1 Hz to 10/sup 6/ Hz and temperatures from 250-423 K. To assess the effect of stereoregularity, three tacticities (i, a and s-PMMA) of similar m…
In this work, the influence of particle size and concentration of fillers used in silicone rubber compounds for outdoor insulation is investigated. Alumina tri-hydrate and silica with mean particle sizes of 5 and 10 /spl mu/m are used as fillers with concentrations of 10, 30 and 50% by weight in a two-part room temper…
β-K 2 Bi 8 Se 13 possesses promising thermoelectric properties whereas Rb 2 Bi 8 Se 13 does not. The formation of solid solutions between these two compounds was attempted to study the alkali metal distribution in the structure and its influence in the electronic properties. The structure of the K 2 - x Rb x Bi 8 Se 1…
The research was focused on the analysis of space charge evolution in oil-paper insulation, and on the evaluation of some peculiar parameters derived from PEA measurements, in order to associate the mobility phenomena with the chemical structure of the dielectric, i.e. the mineral content of cable paper.
A novel solution is presented that deals with the well known problem of clogging in microfluidic channels caused by gas bubbles. The presented approach involves the use of a single channel with different, parallel cross sections. In each of these cross-sections different capillary forces act on the fluid and on potent…
In this paper, we roughly describe the principles and structures for the sensor applications and diagnostic algorithm together with networking and monitoring system for GIS. Firstly, we describe the detailed specifications and the results of research, and then present the experimental results of the diagnostic algorit…
Neutron reflectivity measurements were performed on a cell membrane mimic system, developed by Liu et al., consisting of a polyelectrolyte multilayer plus synthetic terpolymer plus a phospholipid layer (PE + TER + PC) assembly, at all of the intermediate steps in the assembly of the composite, to obtain neutron scatte…
The effects of material properties and inclusions on the space charge profiles in LDPE and XLPE were examined. Whereas the charge profile in LDPE is influenced by material properties such as the degree of crystallinity and MFR, the charge profile in XLPE is influenced by inclusions in the material such as acetophenone…
This work explores the thermal behavior of silicone rubber filled at different concentrations with alumina trihydrate (ATH) and silica. Three particle sizes, 1.5 /spl mu/m, 5 /spl mu/m and 10 /spl mu/m, were employed in the sample preparation. A near-infrared laser was used to heat the samples. The concentration of th…
A high performance thermal interface material has been developed that consists of a 25 /spl mu/m coating of low-melting-temperature alloy (LMTA) tinned on each side of a 50 /spl mu/m copper substrate. The alloy has a melting point below the maximum CPU operating temperature. Steady-state tests per ASTM D-5470 show 0.0…
This paper investigates the impact of Joule heating on the scaling trends of advanced VLSI interconnects. It shows that the interconnect Joule heating can strongly affect the maximum operating temperature of the global wires which, in turn, will constrain the scaling of current density to mitigate electromigration and…
Studied stress-induced voiding in Cu interconnects in the temperature range below 250/spl deg/C, and found two different voiding modes. One mode occurs inside a via having wide wire above it, and can be suppressed by optimizing the via shape and the via-cleaning process. The other mode occurs under a via having wide w…
Electromigration is a well-known wearout mechanism for metallic interconnects on integrated circuit chips, and has been studied for decades in Al metallization, and for the last several years in Cu metallization. Chip failure is caused by either catastrophic electrical open or by resistance shifts sufficiently large t…
We have studied both the etching of SiO2 film and the growth of an amorphous fluorinated carbon (a-C:F) film by mass-analyzed fluorocarbon ion irradiation. This experiment was done in an ultrahigh vacuum with a pressure of 10−7 Pa even during irradiation. When using a carbon monoflouride (CF1+) ion with an energy of 3…
The development status of Ovonic Unified Memory (OUM), a phase-change non-volatile semiconductor memory technology for VLSI stand-alone memory and embedded applications, is discussed. Using 0.18 μm 3 V CMOS, cells from 5F/sup 2/ to 8F/sup 2/ are built in a charge-pump-free 4 Mb development vehicle. Direct overwrite, 1…
We derive the effective low-energy theory for interacting electrons in metallic single-wall carbon nanotubes, taking into account phonon exchange due to twisting, stretching, and breathing modes within a continuum elastic description. In many cases, the nanotube can be described as a standard Luttinger liquid with pos…
Electromigration is caused by high current density stress in metallization patterns and is a major source of breakdown in electronic devices. It is therefore an important reliability issue to verify current densities within all stressed metallization patterns. In this paper we propose a new methodology for hierarchica…