Claudia Patricia Torres2012-11-01PolyPublie (École Polytechnique de Montréal)
DÉDICACEÀ ma famille REMERCIEMENTS J'aimerais tout d'abord exprimer mes sincères remerciements à mon directeur de recherche Pr.Mario Jolicoeur pour l'opportunité qu'il m'a offerte, son aide et le temps qu'il a bien voulu me consacrer.Merci aussi à mon co-directeur de recherche Pr.Abdellah Ajji pour avoir accepté de va…
Electrospun Nanofibers in Biomedical ApplicationsTissue Engineering and Regenerative MedicineInfectious Aortic and Vascular Conditions
Matti Pitkänen2012-11-01viXra
In zero energy ontology (ZEO) lattices in the 3-D hyperbolic manifold defined by H3 (t2-x2-y2-z2=a2) (and known as hyperbolic space to distinguish it from other hyperbolic manifolds emerge naturally. The interpretation of H3 as a cosmic time=constant slice of space-time of sub-critical Robertson-Walker cosmology (givi…
Biofield Effects and BiophysicsQuasicrystal Structures and PropertiesAdvanced Mathematical Theories and Applications
A. Sanches‐Silva、Tulio Rodrigues Ribeiro、T.G. Albuquerque 等 12 位作者2012-11-01Portuguese National Funding Agency for Science, Research and Technology (RCAAP Project by FCT)
Introduction: Chitosan has multiple applications and as inhibitor of microbial growth, there is interest in developing new methodologies to its incorporation into plastics, which would avoid microbial growth in foods. In the frame of the project “Preparation of active packaging with antioxidant and antimicrobial activ…
Nanocomposite Films for Food Packaging
Andreas Jagenbrein、Peter Tscheliesnig、J. Wachsmuth 等 4 位作者2012-11-01Materials Testing
Ermuedungsrisswachstum und aktive Korrosion sind die hauptsaechlichen Ursachen fuer strukturelles Versagen von Transportmitteln, wie Tankfahrzeugen auf Strasse und Schiene sowie Schiffen. Innerhalb des 7. EU-Forschungsrahmenprogramms hat das Projekt CORFAT zum Ziel, eine neue Technologie auf Grundlage der Schallemissi…
Mechanical Failure Analysis and SimulationHydrogen embrittlement and corrosion behaviors in metalsStructural Integrity and Reliability Analysis
Kristen T. Morin2012-11-01University of Minnesota Digital Conservancy (University of Minnesota)
University of Minnesota Ph.D. dissertation. Ph.D. November 2012. Major:Biomedical Engineering. Advisor: Robert T. Tranquillo. 1 computer file (PDF); iv, 301 pages, appendices A-C.
Electrospun Nanofibers in Biomedical ApplicationsBlood properties and coagulationMesenchymal stem cell research
Brian T. Murphy2012-11-01Arrow@dit (Dublin Institute of Technology)
The aim of this research was to investigate the photo-Friedel-Crafts acylation of napthoquinone with a variety of aldehydes using a Rayonet reactor. The long-term aim of this project was to apply this research to the synthesis of biologically active natural products such as alkannin and shikonin.\nAs a 100% atom effic…
Porphyrin and Phthalocyanine ChemistryOxidative Organic Chemistry ReactionsOrganic Chemistry Cycloaddition Reactions
L Jayawardena、Shao Xu2012-11-01OpenAlex
The heavy haul bridge over the Main Southern Railway is a 22 m single span bridge designed to comply with the bridge design code AS 5100 and the operation of a fully laden 163 t CAT 777F truck. Cast in-situ special performance traffic barriers are designed for the containment of a fully laden CAT 777F truck travelling…
Railway Engineering and DynamicsTransportation Safety and Impact AnalysisEngineering and Material Science Research
Paul Flynn、John C. Moore2012-11-01Wafer-Level Packaging Symposium
ABSTRACT Incentives of form factor, performance, and cost reduction are urging the integration of three-dimensional packaging of integrated circuits (3DIC) and promoting thinner substrates. To maintain this trend, new ways of rapid metrology measurement with solutions to achieve substrate bow reduction are needed. FRT…
Near-Field Optical MicroscopyOptical Coatings and Gratings3D IC and TSV technologies
Kari Schjølberg‐Henriksen、E. Poppe、A.S. Moen 等 4 位作者2012-11-01Wafer-Level Packaging Symposium
ABSTRACT Metal-based wafer-level bonding seems well suited for hermetic wafer-level packaging at low cost. We have compared the performance of Au-Au thermocompression bonding, Al-Al thermocompression bonding, and Ti-Si bonding, applying the same test wafer design for all three processes. Device yield, bond strength, a…
Copper Interconnects and Reliability3D IC and TSV technologiesElectronic Packaging and Soldering Technologies
Michelle Velderrain、Danielle Peak2012-11-01Wafer-Level Packaging Symposium
ABSTRACT Silicone materials exhibit unique characteristics including chemical stability and a broad operating temperature range, allowing for preservation of mechanical properties when exposed to extreme conditions. These and other dynamic attributes of silicone help to provide multiple solutions to the complex challe…
Silicone and Siloxane ChemistrySynthesis and properties of polymersPolymer Science and PVC
H. Meynen、Ranjith John、Ken Weidner 等 8 位作者2012-11-01Wafer-Level Packaging Symposium
ABSTRACT Materials of Dow Corning® brand WL-55XX Photopatternable Silicones can easily be coated onto different substrates at thicknesses ranging from 6 to 45 μm for a single coating, and patterned using standard photolithographic processes. Unique to these materials is that the required exposure dose is film thicknes…
Photopolymerization techniques and applicationsNanofabrication and Lithography TechniquesCopper Interconnects and Reliability
Hiroya Ishida、Kiyoto Matsushita2012-11-01Wafer-Level Packaging Symposium
ABSTRACT A unique plastic-cored solder ball (PCSB) developed by Sekisui Chemical Co., Ltd consists of plastic core, copper layer and solder layer. It enables high reliability as a solder bonding material in Wafer-level Chip Size Package (WLCSP) by dispersing the occurred stress via its flexible plastic core. Currently…
Electronic Packaging and Soldering TechnologiesCopper Interconnects and Reliability3D IC and TSV technologies
Laurent Gay、Sébastien Gallois-Garreignot、F. Guyader 等 5 位作者2012-11-01Wafer-Level Packaging Symposium
ABSTRACT The reliability of lead-free solder joints is a major concern of new packaging technology and assembly (Through Silicon Via (TSV), 3D IC integration…). For CMOS image sensors using TSV technology, 300μm balls are deposited by screen printing on the copper surface of the redistribution layer (RDL). Many tests,…
Electronic Packaging and Soldering TechnologiesCopper Interconnects and Reliability3D IC and TSV technologies
Bob Wetterman2012-11-01On-Demand Webinars
ABSTRACT While BGAs are relatively forgiving in their placement on PCBs there is fallout requiring the rework of BGAs. This course is a primer on the the various aspects of the process from initial inspection through the site preparation, placement and final inspection. If you are just beginning to place BGAs and know…
Experience-Based Knowledge ManagementElectronic Packaging and Soldering TechnologiesMaterial Selection and Properties
John Moran2012-11-01SPIE eBooks
This specially curated group of 178 titles covers subjects ranging from biodiversity conservation to agriculture and ecology to zoology. Books explore urban ecology, climate change, fire mitigation, and more. These titles are included in the CSIRO Publishing BioSelect Collection.
Metallurgy and Material ScienceFire effects on ecosystemsEarthquake and Disaster Impact Studies
John Moran2012-11-01SPIE eBooks
This specially curated group of 178 titles covers subjects ranging from biodiversity conservation to agriculture and ecology to zoology. Books explore urban ecology, climate change, fire mitigation, and more. These titles are included in the CSIRO Publishing BioSelect Collection.
Fire effects on ecosystemsMetallurgy and Material ScienceEarthquake and Disaster Impact Studies
John Moran2012-11-01SPIE eBooks
This specially curated group of 178 titles covers subjects ranging from biodiversity conservation to agriculture and ecology to zoology. Books explore urban ecology, climate change, fire mitigation, and more. These titles are included in the CSIRO Publishing BioSelect Collection.
Climate Change and Environmental ImpactMetallurgy and Material ScienceEarthquake and Disaster Impact Studies
John Moran2012-11-01SPIE eBooks
This specially curated group of 178 titles covers subjects ranging from biodiversity conservation to agriculture and ecology to zoology. Books explore urban ecology, climate change, fire mitigation, and more. These titles are included in the CSIRO Publishing BioSelect Collection.
Climate Change and Environmental ImpactEarthquake and Disaster Impact StudiesMetallurgy and Material Science
Peter Sørensen、Bent T. Christensen2012-11-01OpenAlex
Fødevareministeriet DepartementetVedrørende notat om test af saftafløb fra lagret fiberfraktion Fødevareministeriet (FVM) har i bestilling til DCA -Nationalt Center for Fødevarer og Jordbrug, den 23.oktober 2012 bedt om en opfølgning på det notat om emissioner fra markstak af fiberfraktion, som DCA fremsendte den 31.a…
Textile materials and evaluations
R.E. Stoller、K. Nordlund、S.P. Simakov2012-11-01OpenAlex
ObjectiveThe objective of this presentation is provide a list of terms and their definitions that should be helpful in framing the discussion of dosimetry and damage correlation in irradiated materials.Some relevant work carried out over the last forty years is also summarized to provide an historical perspective on t…
Nuclear reactor physics and engineeringNuclear and radioactivity studiesNuclear Materials and Properties