Keisei Suzuki、Kenichi Ikari、Hiroaki Imai2003-12-23OpenAlex
A well-ordered hexagonal structure of the mesopores was produced by previous hydrolysis of tetraethoxysilane with hydrochloric acid and subsequent assembly of cationic surfactant micelles and anionic silicate species at a basic condition. Mesoporous silica nanoparticles (20-50 nm) having a well-ordered hexagonal mesos…
Zeolite Catalysis and SynthesisMesoporous Materials and CatalysisPolyoxometalates: Synthesis and Applications
Kuiyang Jiang、Linda S. Schadler、Richard W. Siegel 等 6 位作者2003-12-23OpenAlex
Ferritin and bovine serum albumin (BSA) proteins are chemically bonded to nitrogen-doped multi-walled carbon nanotubes (CNx MWNTs) through a two-step process of diimide-activated amidation. First, carboxylated CNx MWNTs were activated by N-ethyl-N′-(3-dimethylaminopropyl)carbodiimide hydrochloride (EDAC), forming a st…
Carbon Nanotubes in CompositesForce Microscopy Techniques and ApplicationsBiotin and Related Studies
Yujiang Song、Yi Yang、Craig J. Medforth 等 10 位作者2003-12-23OpenAlex
Seeding and autocatalytic reduction of platinum salts in aqueous surfactant solution using ascorbic acid as the reductant leads to remarkable dendritic metal nanostructures. In micellar surfactant solutions, spherical dendritic metal nanostructures are obtained, and the smallest of these nanodendrites resemble assembl…
Gold and Silver Nanoparticles Synthesis and ApplicationsDendrimers and Hyperbranched PolymersNanocluster Synthesis and Applications
Zhi‐Pan Liu、Xue‐Qing Gong、Jorge Kohanoff 等 5 位作者2003-12-23OpenAlex
CO oxidation on TiO2 supported Au has been studied using density functional theory calculations. Important catalytic roles of the oxide have been identified: (i) CO oxidation occurs at the interface between Au and the oxide with a very small barrier; and (ii) O2 adsorption at the interface is the key step in the react…
Electrocatalysts for Energy ConversionCatalytic Processes in Materials ScienceCatalysis and Oxidation Reactions
Daisuke Kawasaki、Daiji Tsuchimura、Wonbong Choi 等 6 位作者2003-12-22Journal of Physics Condensed Matter
Nitrogen-doped chemical vapour deposited diamond-like carbon (DLC) films were treated by reactive ion etching system under various conditions of CHF3 gas successively after pre-treatment with oxygen. Atomic force microscopy and Raman spectroscopy were carried out in order to characterize the surface morphology and che…
Semiconductor materials and devicesDiamond and Carbon-based Materials ResearchForce Microscopy Techniques and Applications
Folusho Oyerokun、Kenneth S. Schweizer2003-12-22The Journal of Chemical Physics
A microscopic integral equation theory of the segmental orientational order parameter, structural correlations and thermodynamics of strained polymer solutions, melts and networks has been developed. The nonclassical problem of the consequences of intermolecular excluded volume repulsions and chain connectivity is add…
Liquid Crystal Research AdvancementsMaterial Dynamics and PropertiesRheology and Fluid Dynamics Studies
John H. O’Haver、Robert Walk、Boonyarach Kitiyanan 等 5 位作者2003-12-22Journal of Environmental Engineering
Laboratory studies and model results were utilized to design packed tower and hollow fiber air stripping units which were field tested with a contaminant-laden surfactant stream. Field units were operated at a 1.9 liter/min liquid flow rate with air/liquid ratios ranging from 20 to 50 and system temperatures ranging f…
Membrane Separation TechnologiesSurface Modification and SuperhydrophobicityAerosol Filtration and Electrostatic Precipitation
Wen‐Wei Wu、Xiaodong Duan、Jingsheng Yuan2003-12-22OpenAlex
A physical model of copper interconnect dielectric breakdown is studied. The general continuity equation about Cu/sup +/ diffusion and drift is evaluated. An analytical expression to predict the lifetime of TDDB is developed. The model predictions agree well with the experimental data at different electric fields and…
Electronic Packaging and Soldering TechnologiesSemiconductor materials and devicesCopper Interconnects and Reliability
Hailong Zhang、Kristen E. Bremmell、Sunil Kumar 等 4 位作者2003-12-22Journal of Biomedical Materials Research Part A
Vitronectin (Vn) is an abundant glycoprotein present in plasma and the extracellular matrix of most tissue and is an important medium required for bone cells to attach and spread on biomaterial surfaces. Hence, Vn adsorption is an initial and key step in implantation. In this study, adsorption of Vn molecules on mica…
Bone Tissue Engineering MaterialsPolymer Surface Interaction StudiesForce Microscopy Techniques and Applications
K. Sato、F. Baier、А. А. Rempel 等 5 位作者2003-12-22Physical review. B, Condensed matter
In quasicrystalline ${\mathrm{Al}}_{70}{\mathrm{Pd}}_{21}{\mathrm{Mn}}_{9},$ atomic processes as, e.g., thermal vacancy formation are studied specifically by a combination of positron lifetime and two-detector coincident Doppler broadening measurements. Two types of vacancies are detected: structural vacancies with an…
Metallic Glasses and Amorphous AlloysQuasicrystal Structures and PropertiesMuon and positron interactions and applications
A. von Glasow、A. Fischer、G. Steinlesberger2003-12-22OpenAlex
Comprehensive investigations were carried out to study the correlation between the temperature coefficient of resistance (TCR) and both the microstructure and the stressvoiding behavior of copper dual damascene (DD) interconnects. TCR values have been investigated with regard to median grain size and crystal lattice d…
Electronic Packaging and Soldering TechnologiesSemiconductor materials and devicesCopper Interconnects and Reliability
Nakako Tokita、Megumi Hirabayashi、Chiaki Azuma 等 4 位作者2003-12-22The Journal of Chemical Physics
In order to investigate the topological effects of chain molecules, united-atom molecular dynamics simulations of a 500-mer polyethylene linked by 50 hexyl groups (a grafted polymer having 52 ends) are carried out and analyzed in terms of Voronoi space division. We find that the volume of a Voronoi polyhedron for a ch…
Polymer crystallization and propertiesPolymer Nanocomposites and PropertiesScientific Research and Discoveries
Christine Hau-Riege、Amit Marathe、Van Pham2003-12-22OpenAlex
We have compared the electromigration performance of Cu electromigration structures with varying line lengths imbedded in two different ILD materials. In the regime of high jL where there is no significant back-stress, we observed that three of the key electromigration parameters (i.e., MTF, n, and /spl sigma/) are co…
Electronic Packaging and Soldering TechnologiesSemiconductor materials and devicesCopper Interconnects and Reliability
Z Q Chen、Takashi Sekiguchi、Xiaoli Yuan 等 5 位作者2003-12-22Journal of Physics Condensed Matter
Undoped ZnO single crystals were implanted with multiple-energy N + ions ranging from 50 to 380 keV with doses from 10 12 to 10 14 cm −2 . Positron annihilation measurements show that vacancy defects are introduced in the implanted layers. The concentration of the vacancy defects increases with increasing ion dose. Th…
Advancements in Battery MaterialsZnO doping and propertiesMuon and positron interactions and applications
A. Yu. Emelyanov、N. A. Pertsev2003-12-22Physical review. B, Condensed matter
The influence of misfit dislocations on the statics and dynamics of $90\ifmmode^\circ\else\textdegree\fi{}$ domains (twins) in epitaxial thin films is studied theoretically. The misfit dislocations create additional potential barriers, which hinder the movements of domain walls along the film/substrate interface. For…
Ferroelectric and Piezoelectric MaterialsAcoustic Wave Resonator TechnologiesSolid-state spectroscopy and crystallography
HaJeung Park、Jacqueline L. Hilsenbeck、Hak Jun Kim 等 7 位作者2003-12-22Molecular Microbiology
The shikimate pathway synthesizes aromatic amino acids and other essential metabolites that are necessary for bacteria, plants and fungi to survive. This pathway is not present in vertebrates and therefore represents an attractive target for antibacterial agents. We have successfully crystallized and solved the struct…
Microbial Natural Products and BiosynthesisEnzyme Structure and FunctionBiochemical and Molecular Research
Y. Iseri、Maki Honda、Y-D Kim 等 6 位作者2003-12-22Journal of Physics Condensed Matter
Scanning tunnelling microscopy (STM) and current imaging tunnelling current spectroscopy (CITS) methods were performed on polycrystalline diamond films grown on silicon substrates grown by microwave plasma-enhanced chemical vapour deposition. Large tunnelling currents were observed at some grain boundaries and crystal…
Diamond and Carbon-based Materials ResearchForce Microscopy Techniques and ApplicationsElectronic and Structural Properties of Oxides
S. Arrese-Igor、Arantxa Arbe、Ángel Alegría 等 5 位作者2003-12-22The Journal of Chemical Physics
We have investigated the dynamics of phenylene rings in a glassy polysulfone (bisphenol-A-polysulfone) by means of quasielastic neutron scattering. Nowadays it is well known that these molecular motions are directly connected with the mechanical properties of engineering thermoplastics in general. The particular syste…
Material Dynamics and PropertiesAdvanced NMR Techniques and ApplicationsSolid-state spectroscopy and crystallography
Shengli Zhang、Shumin Zhao、Minggang Xia 等 5 位作者2003-12-22Physical review. B, Condensed matter
We investigate ring formation of single-walled carbon nanotubes theoretically in this paper. The conformation energy of the nanotubes is identified as the curvature elastic energy of a curved graphite and the intertube van der Waals interaction. The entropy of ring nanotubes depends on the total number of carbon atoms…
Carbon Nanotubes in CompositesGraphene research and applicationsFullerene Chemistry and Applications
K.Y.-Y. Doong、Ruolong Wang、Shao Lin 等 9 位作者2003-12-22OpenAlex
Stress induced voiding (SIV) is explored from the aspects of design attribute and geometry parameters. Two kinds of test structures were used to evaluate resistance change in relation to reliability and to understand the SIV mechanism. Thus, a reliability-robustness guideline from a consideration of geometry configura…
Electronic Packaging and Soldering TechnologiesSemiconductor materials and devicesCopper Interconnects and Reliability