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All-Copper Chip-to-Substrate Interconnection

Hyo-Chol Koo、Ping An、Paul A. Kohl2010-07-08ECS Meeting Abstracts

Abstract not Available.

Molecular Junctions and Nanostructures3D IC and TSV technologiesCopper Interconnects and Reliability

Photocatalytic Performance of Silicon Nanowire Arrays

Nacéra Megouda、Sabine Szunerits、Yannick Coffinier 等 5 位作者2010-07-08ECS Meeting Abstracts

Abstract not Available.

Silicon Nanostructures and PhotoluminescenceNanowire Synthesis and ApplicationsAnodic Oxide Films and Nanostructures