Materials Literature
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Paper reports morphological and humidity sensing application of Cu2O doped ZnO composite prepared by solid state reaction. Pellet samples of ZnO-Cu2O nanocrystalline powders with 5, 10, 15 and 20 weight % of Cu2O in ZnO have been prepared. These pellets have been annealed at temperatures 200-500°C. When samples have b…
A crystal growth unit has been designed for Cd1 − x Zn x Te growth by the axial-heat-flux-close-to-the-phase-interface (AHP) method at argon overpressures of up to 12 MPa. The influence of melt superheating, growth rate, melt layer thickness, argon pressure, and growth mode on the Zn distribution in 21- to 45-mm-diame…
The process of formation and decomposition of solid films of germanium monoxide from GeO vapor was studied using physical and chemical approaches. A model clarifying the metastability of solid GeO is developed. According the model, the structure of atomic orbitals (sigma- and n- bonds) of a GeO molecule causes the sta…
Using method of Auger electronic spectroscopy, we experimentally research an influence of microwave treatment on efficient thickness modification in transition layer of Mo-GaAs contacts. It is shown that parameters of Schottky barriers (barriers height ϕ B and ideality factor n) are correlated with efficient thickness…
The objective of this study is to assess the environmentally friendly Ni(II) adsorption from synthetic wastewater using extracellular biopolymer(PS-2) produced by Pseudomonas fluorescence C-2. The ability of PS-2 to remove the Ni(II) ions was investigated by using batch biosorption procedure. The effects such as pH, d…
The aim of this work is to develop a high electrocatalyst system for hydrogen evolution utilizing palladium electrode ensemble (Pd-NEE). The work proposes a novel fabrication process to fabricate Pd-NEE using electroless deposition of Pd in a thin porous polycarbonate (PC) film for high performance electrochemical det…
New monomer—1,3,5-tri(4-pinacolatoborolanephenyl)benzene (2) was obtained by Suzuki reaction of 1,3,5-tri(4-iodinephenyl)bensene (1) with bis-pinacolatodiborolane in the presence of [1,1′-bis(dydiphenylphosfino)-ferrocene]di-chloropalladium(II) as catalyst (PdCl 2 [dppf]). Hyperbranched polyphenylenes P1 and P3, which…
Si-SiO2multilayer nanoscale structures were obtained using а procedures of α-Si:H thin film depositions and subsequently plasma enhanced oxidation. Thus, a structure containing 6 layers of α-Si:H with thickness of 50 Å, inserted between the layers of SiO2with thickness 150 Å has been created. The experimental setup wi…
In this study, a thermodynamic analysis is conducted to investigate the chemical effect, in terms of intrinsic contact angle (CA), on the superhydrophobic behavior. It is theoretically revealed that the essential effect of intrinsic CA is to promote the composite transition. In particular, a large intrinsic CA more th…
Synthesis and characterization of copolymers based on poly(ethylene glycol) mono methyl ether-gpoly( methacrylic acid-co-methyl methacrylate) via a polymeric precursor method is reported. Grafting was accomplished based on direct condensation reaction in the presence of dicyclohexylcarbodiimide as an esterification pr…
Zinc oxide is a wide band gap (∼3.4ev) semiconductor material, making it a promising material for high temperature applications, such as exhaust and flue environments where NO and NO2monitoring is increasingly required due to stricter emission controls[1]. In these environments water vapour and background levels of ox…
Er-doped silicon-rich silicon nitride (SRN) films were deposited on silicon substrate by an RF magnetron reaction sputtering system. After high temperature annealing, the films show intense photoluminescence in both the visible and infrared regions. Besides broad-band luminescence centered at 780 nm which originates f…
All major parameters of electronic PCM characterization happen to have some significant ¿nonuniversalities.¿ The presence of electrical contacts and interfaces allows only limited application of programming mechanisms typical for optical memory to electronic PCM. The fine structure of current voltage (IV) in a prethre…
Within this work a cost-effective thin film-sensor-technology based on PVDF-TrFE polymers for detection of ambient changes of temperature has been developed. A wet-\chemical fabrication routine for obtaining ferroelectric thin films has been developed leading to a gammabutyrolactone based sol-gel process. The suitabil…
Summary The Alpines Steinschaf is an old and traditional sheep breed living in the Alps for several hundred years. In 1985 only a few small flocks of this breed could be identified in special alpine regions in Germany. A breeding programme was established by some interested breeders and official breeding organisations…
The reduction of a partially deprotonated bishydroxylamine complex {(tBu2Ga)2[cyclo-ON(Me)(CH2)2- (Me)NO][HON(Me)(CH2)2(Me)(H)NO]} with a reagent composed of titanium tetrachloride and methyllithium leads to the reduction of one of the N-O groups to an amine function affording the salt {(tBu2Ga)[cyclo- ON(H)(Me)(CH2)2…
Requirements for current-conducting adhesives used to assemble electric and radio products are formulated. Current-conducting adhesives presently used in Russian and foreign practice are reviewed. The main characteristics of current-conducting, hot-cured TZK-14s adhesive developed at OAO Kompozit are given. Based on p…
We have developed a photonic crystal-based hydrogel which changes volume upon exposure to light and possesses unique optical properties. The photoswitchable material was created by embedding a crystalline colloidal array into a polyacrylamide network, and then infusing a second network, consisting of an azobenzene der…
The nickel ion containing Langmuir–Blodgett (LB) multilayer was prepared by transferring first dissolving nickel acetate and the solution was poured into a subphase of ultrapure water and stearic acid-chloroform. The resultant mixture was then spread onto a hydrophilic water or glass plate. Then the multilayer was con…
Most future electronic applications require better reliability and performance as well as lower-priced productions. In order to reach these general demands, three-dimensional (3D) IC packaging technologies are assuming important roles and have been vastly studied in electronic industry. In this investigation, two kind…