Toshihiro Kondo、Masayo Shibata、Naoko Hayashi 等 8 位作者2009-07-10ECS Meeting Abstracts
Abstract not Available.
Electron and X-Ray Spectroscopy TechniquesAnodic Oxide Films and NanostructuresAdvanced Materials Characterization Techniques
M. Schneider、Ulrike Langklotz、Mathias Weiser 等 4 位作者2009-07-10ECS Meeting Abstracts
Abstract not Available.
Semiconductor materials and devicesAnodic Oxide Films and NanostructuresIntegrated Circuits and Semiconductor Failure Analysis
Andrew R. Morrill、Duc T. Duong、Seung J. Lee 等 4 位作者2009-07-10ECS Meeting Abstracts
Abstract not Available.
Gold and Silver Nanoparticles Synthesis and ApplicationsElectrochemical sensors and biosensors
Daniel Guay、C. Chabanier2009-07-10ECS Meeting Abstracts
Abstract not Available.
Catalytic Processes in Materials ScienceRadioactive element chemistry and processingElectron and X-Ray Spectroscopy Techniques
Gianfranco Pacchioni2009-07-10ECS Meeting Abstracts
Abstract not Available.
ZnO doping and propertiesCatalytic Processes in Materials ScienceTransition Metal Oxide Nanomaterials
V. Svoboda、Jian‐Jun Wei、Christopher Onwere 等 7 位作者2009-07-10ECS Meeting Abstracts
Abstract not Available.
Electrochemical sensors and biosensorsFuel Cells and Related MaterialsConducting polymers and applications
Shinji Fujimoto、Takanobu Sugimoto、Takeshi Tamura 等 6 位作者2009-07-10ECS Meeting Abstracts
Abstract not Available.
Bone Tissue Engineering MaterialsTitanium Alloys Microstructure and Properties
Lakshman Neelakantan、Srdjan Milenković、Achim Walter Hassel2009-07-10ECS Meeting Abstracts
Abstract not Available.
Advanced Thermoelectric Materials and DevicesChalcogenide Semiconductor Thin FilmsShape Memory Alloy Transformations
E.C. Almeida、Leonardo Lusuti Medeiros、Maurício Ribeiro Baldan 等 5 位作者2009-07-10ECS Meeting Abstracts
Abstract not Available.
Supercapacitor Materials and FabricationFuel Cells and Related MaterialsConducting polymers and applications
H. N. McMurray、Zak Barrett、G. Williams2009-07-10ECS Meeting Abstracts
Abstract not Available.
Material Properties and ApplicationsAdvancements in Materials EngineeringPolymer Science and Applications
Mikhail L. Zheludkevich、João Tedim、Silvar Kallip 等 4 位作者2009-07-10ECS Meeting Abstracts
Abstract not Available.
Corrosion Behavior and InhibitionNanocomposite Films for Food PackagingPolymer Surface Interaction Studies
Z. Stoynov、Daria Vladikova2009-07-10ECS Meeting Abstracts
Abstract not Available.
Corrosion Behavior and InhibitionHydrogen embrittlement and corrosion behaviors in metalsElectrochemical Analysis and Applications
Darren J. LeClere、S.J. Garcia-Vergara、Fan Zhou 等 6 位作者2009-07-10ECS Meeting Abstracts
Abstract not Available.
Anodic Oxide Films and Nanostructures
Michael S. Pierce、Andreas Menzel、Vojislav R. Stamenković 等 6 位作者2009-07-10ECS Meeting Abstracts
Abstract not Available.
Advanced Chemical Physics StudiesCatalytic Processes in Materials ScienceCatalysis and Oxidation Reactions
Héctor D. Abruña2009-07-10ECS Meeting Abstracts
Abstract not Available.
Electrocatalysts for Energy ConversionElectrochemical Analysis and ApplicationsAnodic Oxide Films and Nanostructures
Andrew P. Abbott、Mohamed Elhadi、A. Robert Hillman 等 5 位作者2009-07-10ECS Meeting Abstracts
Abstract not Available.
Additive Manufacturing and 3D Printing TechnologiesSynthesis and properties of polymersMaterial Properties and Applications
Viktor Bandur、Qingfeng Li、Niels J. Bjerrum2009-07-10ECS Meeting Abstracts
Abstract not Available.
Ionic liquids properties and applicationsCrystallization and Solubility StudiesThermal and Kinetic Analysis
John L. Stickney、Dhego Banga、N. Jayaraju 等 4 位作者2009-07-10ECS Meeting Abstracts
Abstract not Available.
Advancements in Solid Oxide Fuel Cells
Michael Reid、Maurice N. Collins2009-07-10ECS Meeting Abstracts
Abstract not Available.
Hydrogen embrittlement and corrosion behaviors in metalsConcrete Corrosion and DurabilityMaterial Properties and Failure Mechanisms
Natasa Vasiljevic、Jonathan Velleuer、W. Schwarzacher2009-07-10ECS Meeting Abstracts
Abstract not Available.
Metal and Thin Film MechanicsElectronic Packaging and Soldering TechnologiesCopper Interconnects and Reliability